Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs

Miao Cai*, Yonghu Liang, Minghui Yun, Xuan-You Chen, Haidong Yan, Zhaozhe Yu, Daoguo Yang, Guoqi Zhang

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

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Engineering & Materials Science

Chemical Compounds