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Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
Chengshuo Jiang, Jiajie Fan, Cheng Qian, Hao Zhang, Xuejun Fan, Weiling Guo, Guoqi Zhang
Research output: Contribution to journal › Article › Scientific › peer-review
40
Citations
(Scopus)