Electrical Current Flow and Cement Hydration: Implications on Cement-Based Microstructure

Agus Susanto, G Peng, Dessi Koleva, Klaas van Breugel

Research output: Contribution to journalArticleScientificpeer-review

90 Downloads (Pure)


Stray current is an electrical current “leakage” from metal conductors and electrical installations. When it flows through cement-based materials, electrical energy is converted to thermal energy that causes increasing temperature due to Joule heating phenomena. The aim of this paper is to shed light on the influence of electrical current flow on cement hydration, thermal properties and pore structure changes of cement-based materials. Calorimetry tests show that degree of cement hydration increases as a results of temperature increase due to electrical current flow through cement-based materials. To evaluate the influence of electrical current on the thermal properties of cement paste, the specific heat of cement paste was calculated based on the degree of cement hydration and temperature development during the hydration process. MIP tests were carried out to quantify changes in the pore structure due to electrical current flow. The results shows that if no other factors are present, leaching is avoided and for relatively early cement hydration age, the electrical current flow accelerates cement hydration, leading to an initial decrease in porosity of the cement paste.
Original languageEnglish
Pages (from-to)1-8
Number of pages8
JournalInternational Journal of Structural and Civil Engineering Research
Issue number2
Publication statusPublished - May 2017
Event2nd International Conference on Architecture, Materials and Construction - Flora Grand hotel, Dubai, United Arab Emirates
Duration: 3 Dec 20165 Dec 2016
Conference number: 2


  • cement hydration
  • stray current
  • microstructure
  • temperature
  • Joule heating


Dive into the research topics of 'Electrical Current Flow and Cement Hydration: Implications on Cement-Based Microstructure'. Together they form a unique fingerprint.

Cite this