Abstract
This paper describes the design, fabrication and characterization of electrothermal bimorph actuators consisting of polysilicon on top of thick (>10 μm ) silicon dioxide beams. This material platform enables the integration of actuators with photonic waveguides, producing mechanically-flexible photonic waveguide structures that are positionable. These structures are explored as part of a novel concept for highly automated, sub-micrometer precision chip-to-chip alignment. In order to prevent residual stress-induced fracturing that is associated with the release of thick oxide structures from a silicon substrate, a special reinforcement method is applied to create suspended silicon dioxide beam structures. The characterization includes measurements of the post-release deformation (i.e., without actuation), as well as the deflection resulting from quasi-static and dynamic actuation. The post-release deformation reveals a curvature, resulting in the free ends of 800 μm long silicon dioxide beams with 5 μm-thick polysilicon to be situated approximately 80 μm above the chip surface. Bimorph actuators that are 800 μm in length produce an out-of-plane deflection of approximately 11 μm at 60 mW dissipated power, corresponding to an estimated 240 oC actuator temperature. The delivered actuation force of the 800 μm-long bimorph actuators having 5 μm-thick polysilicon is calculated to be approximately 750 μN at 120 mW.
Original language | English |
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Article number | 200 |
Pages (from-to) | 1-20 |
Journal | Micromachines |
Volume | 7 |
Issue number | 11 |
DOIs | |
Publication status | Published - 2016 |
Keywords
- bimorph actuator
- photonic waveguide
- silicon reinforcement
- curvature
- deflection
- bending stiffness
- transient response
- OA-Fund TU Delft