EMC oxidation under high temperature aging

A.S. Inamdar, Przemyslaw Jakub Gromala, Alexandru Prisacaru, Alexander Kabakchiev, Yu Hsiang Yang, Bongtae Han

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

1 Citation (Scopus)
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Epoxy molding compound (EMC) is widely used for encapsulating automotive electronics. Among all of the components of an electronic package, EMC is most exposed to the atmosphere, and thus undergoes aging. During high-temperature operation, EMC is oxidized, which alters its mechanical properties, and thus can affect the reliability of electronic components. This chapter focuses on four key aspects of EMC oxidation – (1) the growth of EMC oxidation layer, (2) the mechanical properties of oxidized EMC, (3) the effect of oxidized EMC on thermomechanical behavior of a molded package, and (4) the effect of EMC oxidation on solder joint reliability. This study utilizes various experimental characterization techniques as well as finite element simulation-based analysis.
Original languageEnglish
Title of host publicationReliability of Organic Compounds in Microelectronics and Optoelectronics
Subtitle of host publicationFrom Physics-of-Failure to Physics-of-Degradation
EditorsWillem Dirk van Driel, Maryam Yazdan Mehr
Number of pages28
ISBN (Electronic)978-3-030-81578-3
ISBN (Print)978-3-030-81575-2
Publication statusPublished - 2022

Bibliographical note

Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.


  • Epoxy molding compound (EMC)
  • thermal aging
  • oxidation
  • fluorescence microscopy
  • activation energy
  • dynamic mechanical analysis (DMA)
  • digital image correlation (DIC)
  • elastic modulus
  • coefficient of thermal expansion (CTE)
  • glass transition temperature
  • moiré interferometry
  • finite element simulation
  • thermal fatigue
  • solder joint reliability

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