Establishment of the coarse grained parameters for epoxy-copper interfacial separation

KY Wong, YY Leung, RH Poelma, KMB Jansen, CA Yuan, WD van Driel, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationElectronic packaging technology and high density packaging (ICEPT-HDP), 2012 Proceedings of the 13th international conference
Editors s.n.
Place of PublicationPiscataway
PublisherIEEE Society
Pages1467-1473
Number of pages7
ISBN (Print)978-1-4673-1682-8
DOIs
Publication statusPublished - 2012
EventThe 13th international conference on electronic packaging technology and high density packaging (ICEPT-HDP), Guilin, Guangxi, China - Piscataway
Duration: 13 Aug 201216 Aug 2012

Publication series

Name
PublisherIEEE

Conference

ConferenceThe 13th international conference on electronic packaging technology and high density packaging (ICEPT-HDP), Guilin, Guangxi, China
Period13/08/1216/08/12

Bibliographical note

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