Establishment of the coarse grained parameters for epoxy-copper interfacial separation

KY Wong, YY Leung, RH Poelma, KMB Jansen, CA Yuan, WD van Driel, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationElectronic packaging technology and high density packaging (ICEPT-HDP), 2012 Proceedings of the 13th international conference
Editors s.n.
Place of PublicationPiscataway
PublisherIEEE Society
Pages1467-1473
Number of pages7
ISBN (Print)978-1-4673-1682-8
DOIs
Publication statusPublished - 2012
EventThe 13th international conference on electronic packaging technology and high density packaging (ICEPT-HDP), Guilin, Guangxi, China - Piscataway
Duration: 13 Aug 201216 Aug 2012

Publication series

Name
PublisherIEEE

Conference

ConferenceThe 13th international conference on electronic packaging technology and high density packaging (ICEPT-HDP), Guilin, Guangxi, China
Period13/08/1216/08/12

Cite this

Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD., & Zhang, GQ. (2012). Establishment of the coarse grained parameters for epoxy-copper interfacial separation. In s.n. (Ed.), Electronic packaging technology and high density packaging (ICEPT-HDP), 2012 Proceedings of the 13th international conference (pp. 1467-1473). IEEE Society. https://doi.org/10.1109/ICEPT-HDP.2012.6474884