Establishment of the mesoscale parameters for epoxy-copper interfacial separation

CKY Wong, SYY Leung, RH Poelma, KMB Jansen, CCA Yuan, WD van Driel, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)
Original languageEnglish
Title of host publication13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012)
Place of Publications.l.
PublisherIEEE Society
Pages1-6
Number of pages6
ISBN (Print)978-1-4673-1512-8
DOIs
Publication statusPublished - 2012
EventEuroSimE 2012: 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Lisbon, Portugal
Duration: 16 Apr 201218 Apr 2012
Conference number: 13

Conference

ConferenceEuroSimE 2012
CountryPortugal
CityLisbon
Period16/04/1218/04/12

Cite this

Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD., & Zhang, GQ. (2012). Establishment of the mesoscale parameters for epoxy-copper interfacial separation. In 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012) (pp. 1-6). IEEE Society. https://doi.org/10.1109/ESimE.2012.6191737