Establishment of the mesoscale parameters for epoxy-copper interfacial separation

CKY Wong; SYY Leung; RH Poelma; KMB Jansen; CCA Yuan; WD van Driel; GQ Zhang

doi:10.1109/ESimE.2012.6191737

Establishment of the mesoscale parameters for epoxy-copper interfacial separation

CKY Wong, SYY Leung, RH Poelma, KMB Jansen, CCA Yuan, WD van Driel, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

3 Citations (Scopus)

Original language	English
Title of host publication	13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012)
Place of Publication	s.l.
Publisher	IEEE
Pages	1-6
Number of pages	6
ISBN (Print)	978-1-4673-1512-8
DOIs	https://doi.org/10.1109/ESimE.2012.6191737
Publication status	Published - 2012
Event	EuroSimE 2012: 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Lisbon, Portugal Duration: 16 Apr 2012 → 18 Apr 2012 Conference number: 13

Conference

Conference	EuroSimE 2012
Country/Territory	Portugal
City	Lisbon
Period	16/04/12 → 18/04/12

Bibliographical note

Article number: 6191737

Access to Document

10.1109/ESimE.2012.6191737

Cite this

Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD., & Zhang, GQ. (2012). Establishment of the mesoscale parameters for epoxy-copper interfacial separation. In 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012) (pp. 1-6). IEEE. https://doi.org/10.1109/ESimE.2012.6191737

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title = "Establishment of the mesoscale parameters for epoxy-copper interfacial separation",

author = "CKY Wong and SYY Leung and RH Poelma and KMB Jansen and CCA Yuan and {van Driel}, WD and GQ Zhang",

note = "Article number: 6191737; EuroSimE 2012 : 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 16-04-2012 Through 18-04-2012",

year = "2012",

doi = "10.1109/ESimE.2012.6191737",

language = "English",

isbn = "978-1-4673-1512-8",

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Wong, CKY, Leung, SYY, Poelma, RH , Jansen, KMB, Yuan, CCA, van Driel, WD & Zhang, GQ 2012, Establishment of the mesoscale parameters for epoxy-copper interfacial separation. in 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012). IEEE, s.l., pp. 1-6, EuroSimE 2012, Lisbon, Portugal, 16/04/12. https://doi.org/10.1109/ESimE.2012.6191737

Establishment of the mesoscale parameters for epoxy-copper interfacial separation. / Wong, CKY; Leung, SYY; Poelma, RH et al.
13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012). s.l.: IEEE, 2012. p. 1-6.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Establishment of the mesoscale parameters for epoxy-copper interfacial separation

AU - Wong, CKY

AU - Leung, SYY

AU - Poelma, RH

AU - Jansen, KMB

AU - Yuan, CCA

AU - van Driel, WD

AU - Zhang, GQ

N1 - Conference code: 13

PY - 2012

Y1 - 2012

U2 - 10.1109/ESimE.2012.6191737

DO - 10.1109/ESimE.2012.6191737

M3 - Conference contribution

SN - 978-1-4673-1512-8

SP - 1

EP - 6

BT - 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012)

PB - IEEE

CY - s.l.

T2 - EuroSimE 2012

Y2 - 16 April 2012 through 18 April 2012

ER -