EUROSERVER: Energy efficient node for European micro-servers

Yves Durand; Paul M. Carpenter; Stefano Adami; Angelos Bilas; Denis Dutoit; Alexis Farcy; Georgi Gaydadjiev; John Goodacre; Manolis Katevenis; Manolis Marazakis; Emil Matus; Iakovos Mavroidis; John Thomson

doi:10.1109/DSD.2014.15

EUROSERVER: Energy efficient node for European micro-servers

Yves Durand, Paul M. Carpenter, Stefano Adami, Angelos Bilas, Denis Dutoit, Alexis Farcy, Georgi Gaydadjiev, John Goodacre, Manolis Katevenis, Manolis Marazakis, Emil Matus, Iakovos Mavroidis, John Thomson

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

44 Citations (SciVal)

Abstract

EUROSERVER is a collaborative project that aims to dramatically improve data centre energy-efficiency, cost, and software efficiency. It is addressing these important challenges through the coordinated application of several key recent innovations: 64-bit ARM cores, 3D heterogeneous silicon-on-silicon integration, and fully-depleted silicon-on-insulator (FD SOI) process technology, together with new software techniques for efficient resource management, including resource sharing and workload isolation. We are pioneering a system architecture approach that allows specialized silicon devices to be built even for low-volume markets where NRE costs are currently prohibitive. The EUROSERVER device will embed multiple silicon 'chiplets' on an active silicon interposer. Its system architecture is being driven by requirements from three use cases: data centres and cloud computing, telecom infrastructures, and high-end embedded systems. We will build two fully integrated full-system prototypes, based on a common micro-server board, and targeting embedded servers and enterprise servers.

Original language	English
Title of host publication	Proceedings - 2014 17th Euromicro Conference on Digital System Design, DSD 2014
Publisher	IEEE
Pages	206-213
Number of pages	8
ISBN (Electronic)	9781479957934
DOIs	https://doi.org/10.1109/DSD.2014.15
Publication status	Published - 16 Oct 2014
Externally published	Yes
Event	17th Euromicro Conference on Digital System Design, DSD 2014 - Verona, Italy Duration: 27 Aug 2014 → 29 Aug 2014

Publication series

Name	Proceedings - 2014 17th Euromicro Conference on Digital System Design, DSD 2014

Conference

Conference	17th Euromicro Conference on Digital System Design, DSD 2014
Country/Territory	Italy
City	Verona
Period	27/08/14 → 29/08/14

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy

Keywords

ARM
FD-SOI
System architecture
Three-dimensional (3D) integrated circuits
Virtualization

Access to Document

10.1109/DSD.2014.15

Cite this

Durand, Y., Carpenter, P. M., Adami, S., Bilas, A., Dutoit, D., Farcy, A., Gaydadjiev, G., Goodacre, J., Katevenis, M., Marazakis, M., Matus, E., Mavroidis, I., & Thomson, J. (2014). EUROSERVER: Energy efficient node for European micro-servers. In Proceedings - 2014 17th Euromicro Conference on Digital System Design, DSD 2014 (pp. 206-213). Article 6927246 (Proceedings - 2014 17th Euromicro Conference on Digital System Design, DSD 2014). IEEE. https://doi.org/10.1109/DSD.2014.15

@inproceedings{ea5fc9fc68bc42218dfcbcbc0349d099,

title = "EUROSERVER: Energy efficient node for European micro-servers",

abstract = "EUROSERVER is a collaborative project that aims to dramatically improve data centre energy-efficiency, cost, and software efficiency. It is addressing these important challenges through the coordinated application of several key recent innovations: 64-bit ARM cores, 3D heterogeneous silicon-on-silicon integration, and fully-depleted silicon-on-insulator (FD SOI) process technology, together with new software techniques for efficient resource management, including resource sharing and workload isolation. We are pioneering a system architecture approach that allows specialized silicon devices to be built even for low-volume markets where NRE costs are currently prohibitive. The EUROSERVER device will embed multiple silicon 'chiplets' on an active silicon interposer. Its system architecture is being driven by requirements from three use cases: data centres and cloud computing, telecom infrastructures, and high-end embedded systems. We will build two fully integrated full-system prototypes, based on a common micro-server board, and targeting embedded servers and enterprise servers.",

keywords = "ARM, FD-SOI, System architecture, Three-dimensional (3D) integrated circuits, Virtualization",

author = "Yves Durand and Carpenter, {Paul M.} and Stefano Adami and Angelos Bilas and Denis Dutoit and Alexis Farcy and Georgi Gaydadjiev and John Goodacre and Manolis Katevenis and Manolis Marazakis and Emil Matus and Iakovos Mavroidis and John Thomson",

year = "2014",

month = oct,

day = "16",

doi = "10.1109/DSD.2014.15",

language = "English",

series = "Proceedings - 2014 17th Euromicro Conference on Digital System Design, DSD 2014",

publisher = "IEEE",

pages = "206--213",

booktitle = "Proceedings - 2014 17th Euromicro Conference on Digital System Design, DSD 2014",

address = "United States",

note = "17th Euromicro Conference on Digital System Design, DSD 2014 ; Conference date: 27-08-2014 Through 29-08-2014",

}

Durand, Y, Carpenter, PM, Adami, S, Bilas, A, Dutoit, D, Farcy, A, Gaydadjiev, G, Goodacre, J, Katevenis, M, Marazakis, M, Matus, E, Mavroidis, I & Thomson, J 2014, EUROSERVER: Energy efficient node for European micro-servers. in Proceedings - 2014 17th Euromicro Conference on Digital System Design, DSD 2014., 6927246, Proceedings - 2014 17th Euromicro Conference on Digital System Design, DSD 2014, IEEE, pp. 206-213, 17th Euromicro Conference on Digital System Design, DSD 2014, Verona, Italy, 27/08/14. https://doi.org/10.1109/DSD.2014.15

EUROSERVER: Energy efficient node for European micro-servers. / Durand, Yves; Carpenter, Paul M.; Adami, Stefano et al.
Proceedings - 2014 17th Euromicro Conference on Digital System Design, DSD 2014. IEEE, 2014. p. 206-213 6927246 (Proceedings - 2014 17th Euromicro Conference on Digital System Design, DSD 2014).

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - EUROSERVER

T2 - 17th Euromicro Conference on Digital System Design, DSD 2014

AU - Durand, Yves

AU - Carpenter, Paul M.

AU - Adami, Stefano

AU - Bilas, Angelos

AU - Dutoit, Denis

AU - Farcy, Alexis

AU - Gaydadjiev, Georgi

AU - Goodacre, John

AU - Katevenis, Manolis

AU - Marazakis, Manolis

AU - Matus, Emil

AU - Mavroidis, Iakovos

AU - Thomson, John

PY - 2014/10/16

Y1 - 2014/10/16

N2 - EUROSERVER is a collaborative project that aims to dramatically improve data centre energy-efficiency, cost, and software efficiency. It is addressing these important challenges through the coordinated application of several key recent innovations: 64-bit ARM cores, 3D heterogeneous silicon-on-silicon integration, and fully-depleted silicon-on-insulator (FD SOI) process technology, together with new software techniques for efficient resource management, including resource sharing and workload isolation. We are pioneering a system architecture approach that allows specialized silicon devices to be built even for low-volume markets where NRE costs are currently prohibitive. The EUROSERVER device will embed multiple silicon 'chiplets' on an active silicon interposer. Its system architecture is being driven by requirements from three use cases: data centres and cloud computing, telecom infrastructures, and high-end embedded systems. We will build two fully integrated full-system prototypes, based on a common micro-server board, and targeting embedded servers and enterprise servers.

AB - EUROSERVER is a collaborative project that aims to dramatically improve data centre energy-efficiency, cost, and software efficiency. It is addressing these important challenges through the coordinated application of several key recent innovations: 64-bit ARM cores, 3D heterogeneous silicon-on-silicon integration, and fully-depleted silicon-on-insulator (FD SOI) process technology, together with new software techniques for efficient resource management, including resource sharing and workload isolation. We are pioneering a system architecture approach that allows specialized silicon devices to be built even for low-volume markets where NRE costs are currently prohibitive. The EUROSERVER device will embed multiple silicon 'chiplets' on an active silicon interposer. Its system architecture is being driven by requirements from three use cases: data centres and cloud computing, telecom infrastructures, and high-end embedded systems. We will build two fully integrated full-system prototypes, based on a common micro-server board, and targeting embedded servers and enterprise servers.

KW - ARM

KW - FD-SOI

KW - System architecture

KW - Three-dimensional (3D) integrated circuits

KW - Virtualization

UR - http://www.scopus.com/inward/record.url?scp=84928801523&partnerID=8YFLogxK

U2 - 10.1109/DSD.2014.15

DO - 10.1109/DSD.2014.15

M3 - Conference contribution

AN - SCOPUS:84928801523

T3 - Proceedings - 2014 17th Euromicro Conference on Digital System Design, DSD 2014

SP - 206

EP - 213

BT - Proceedings - 2014 17th Euromicro Conference on Digital System Design, DSD 2014

PB - IEEE

Y2 - 27 August 2014 through 29 August 2014

ER -

EUROSERVER: Energy efficient node for European micro-servers

Abstract

Publication series

Conference

UN SDGs

Keywords

Access to Document

Other files and links

Fingerprint

Cite this