Evaluation of Resistance for Chip on Chip Bonding using "AlSi/TiN" bumps with ACP

M Akiyama, D Zhang, MJ Lee, E Charbon

Research output: Contribution to conferenceAbstractScientific

Original languageUndefined/Unknown
Pages1-1
Number of pages1
Publication statusPublished - 2015
Event62nd JSAP Spring Meeting, Hiratsuka, Japan - s.l.
Duration: 11 Mar 201514 Mar 2015

Conference

Conference62nd JSAP Spring Meeting, Hiratsuka, Japan
Period11/03/1514/03/15

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