Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

D Yang, KMB Jansen, LJ Ernst, GQ Zhang, JGJ Beijer, JHJ Janssen

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

7 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationPolytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
EditorsA Dziedzic, J Felba
Place of PublicationPiscataway
PublisherIEEE Society
Pages1-5
Number of pages5
ISBN (Print)0-7803-9553-0
Publication statusPublished - 2005
Event5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland - Piscataway
Duration: 23 Oct 200526 Oct 2005

Publication series

Name
PublisherIEEE

Conference

Conference5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland
Period23/10/0526/10/05

Keywords

  • Conf.proc. > 3 pag

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