Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

D Yang; KMB Jansen; LJ Ernst; GQ Zhang; JGJ Beijer; JHJ Janssen

Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

D Yang, KMB Jansen, LJ Ernst, GQ Zhang, JGJ Beijer, JHJ Janssen

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

9 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
Editors	A Dziedzic, J Felba
Place of Publication	Piscataway
Publisher	IEEE
Pages	1-5
Number of pages	5
ISBN (Print)	0-7803-9553-0
Publication status	Published - 2005
Event	5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland - Piscataway Duration: 23 Oct 2005 → 26 Oct 2005

Publication series

Name
Publisher	IEEE

Conference

Conference	5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland
Period	23/10/05 → 26/10/05

Keywords

Conf.proc. > 3 pag

Cite this

Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Beijer, JGJ., & Janssen, JHJ. (2005). Experimental and numerical investigation on warpage of QFN packages induced during the array molding process. In A. Dziedzic, & J. Felba (Eds.), Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics (pp. 1-5). IEEE.

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title = "Experimental and numerical investigation on warpage of QFN packages induced during the array molding process",

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author = "D Yang and KMB Jansen and LJ Ernst and GQ Zhang and JGJ Beijer and JHJ Janssen",

year = "2005",

language = "Undefined/Unknown",

isbn = "0-7803-9553-0",

publisher = "IEEE",

pages = "1--5",

editor = "A Dziedzic and J Felba",

booktitle = "Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics",

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note = "5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland ; Conference date: 23-10-2005 Through 26-10-2005",

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Yang, D, Jansen, KMB, Ernst, LJ, Zhang, GQ, Beijer, JGJ & Janssen, JHJ 2005, Experimental and numerical investigation on warpage of QFN packages induced during the array molding process. in A Dziedzic & J Felba (eds), Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. IEEE, Piscataway, pp. 1-5, 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland, 23/10/05.

Experimental and numerical investigation on warpage of QFN packages induced during the array molding process. / Yang, D; Jansen, KMB; Ernst, LJ et al.
Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. ed. / A Dziedzic; J Felba. Piscataway: IEEE, 2005. p. 1-5.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

AU - Yang, D

AU - Jansen, KMB

AU - Ernst, LJ

AU - Zhang, GQ

AU - Beijer, JGJ

AU - Janssen, JHJ

PY - 2005

Y1 - 2005

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-9553-0

SP - 1

EP - 5

BT - Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics

A2 - Dziedzic, A

A2 - Felba, J

PB - IEEE

CY - Piscataway

T2 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland

Y2 - 23 October 2005 through 26 October 2005

ER -