@inproceedings{a36347712f4741768974677e8382bb5a,
title = "Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips",
author = "{Rezaie Adli}, AR and KMB Jansen and F Schindler-Saefkow and F Rost",
year = "2014",
doi = "10.1109/EuroSimE.2014.6813837",
language = "English",
isbn = "978-1-4799-4791-1",
pages = "1--4",
editor = "B Vandevelde",
booktitle = "Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems",
publisher = "IEEE Society",
note = "EuroSimE 2014 : IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 07-04-2014 Through 09-04-2014",
}