INIS
molding
100%
levels
100%
fans
100%
optimization
100%
verification
100%
panels
100%
thermal expansion
66%
simulation
50%
epoxides
33%
geometry
33%
molds
33%
performance
33%
dies
33%
design
16%
substrates
16%
carriers
16%
cooling
16%
thickness
16%
films
16%
curing
16%
layers
16%
glass
16%
transition temperature
16%
computer codes
16%
errors
16%
cost
16%
shrinkage
16%
size
16%
Engineering
Optimization
100%
Coefficient of Thermal Expansion
80%
Moulding Process
60%
Experiments
40%
Stages
40%
Electrical Performance
20%
Simulation Method
20%
Thermal Performance
20%
Error
20%
Experimental Result
20%
Constituent Material
20%
Simulation Result
20%
Design
20%
Substrates
20%
Low Coefficient
20%
Material Science
Thermal Expansion
100%
Temperature
50%
Film
25%
Shrinkage
25%
Glass Transition Temperature
25%