Experimental verification of a stress singularity model to predict the effect of bondline thickness and loading direction on adhesive joint strength

MJL van Tooren; A van den Berg

Experimental verification of a stress singularity model to predict the effect of bondline thickness and loading direction on adhesive joint strength

MJL van Tooren, A van den Berg

Structural Integrity & Composites

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Kleben Swiss Bonding 05 - 19.Intern. Symposium Swissbonding
Editors	prof. Ed. Schindel-Bidinelli
Place of Publication	Bulach, Switzerland
Publisher	SWIBOTECH GmbH
Pages	353-364
Number of pages	12
Publication status	Published - 2005
Event	19. Internationales Symposium SWISSBONDING - Bulach, Switzerland Duration: 22 May 2005 → 25 May 2005

Publication series

Name
Publisher	SWIBOTECH GmbH

Conference

Conference	19. Internationales Symposium SWISSBONDING
Period	22/05/05 → 25/05/05

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{a82d6a54da594c9cbe71ca23ad7bf7cf,

title = "Experimental verification of a stress singularity model to predict the effect of bondline thickness and loading direction on adhesive joint strength",

keywords = "Conf.proc. > 3 pag",

author = "{van Tooren}, MJL and {van den Berg}, A",

year = "2005",

language = "Undefined/Unknown",

publisher = "SWIBOTECH GmbH",

pages = "353--364",

editor = "{prof. Ed. Schindel-Bidinelli}",

booktitle = "Kleben Swiss Bonding 05 - 19.Intern. Symposium Swissbonding",

note = "19. Internationales Symposium SWISSBONDING ; Conference date: 22-05-2005 Through 25-05-2005",

}

van Tooren, MJL & van den Berg, A 2005, Experimental verification of a stress singularity model to predict the effect of bondline thickness and loading direction on adhesive joint strength. in prof. Ed. Schindel-Bidinelli (ed.), Kleben Swiss Bonding 05 - 19.Intern. Symposium Swissbonding. SWIBOTECH GmbH, Bulach, Switzerland, pp. 353-364, 19. Internationales Symposium SWISSBONDING, 22/05/05.

Experimental verification of a stress singularity model to predict the effect of bondline thickness and loading direction on adhesive joint strength. / van Tooren, MJL; van den Berg, A.
Kleben Swiss Bonding 05 - 19.Intern. Symposium Swissbonding. ed. / prof. Ed. Schindel-Bidinelli. Bulach, Switzerland: SWIBOTECH GmbH, 2005. p. 353-364.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Experimental verification of a stress singularity model to predict the effect of bondline thickness and loading direction on adhesive joint strength

AU - van Tooren, MJL

AU - van den Berg, A

PY - 2005

Y1 - 2005

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 353

EP - 364

BT - Kleben Swiss Bonding 05 - 19.Intern. Symposium Swissbonding

A2 - prof. Ed. Schindel-Bidinelli, null

PB - SWIBOTECH GmbH

CY - Bulach, Switzerland

T2 - 19. Internationales Symposium SWISSBONDING

Y2 - 22 May 2005 through 25 May 2005

ER -