Fabrication and characterization of high aspect ratio silicon plate springs with high out-of plane stiffness

HW van Zeijl; SL Paalvast; J Su; J van Eijk; PM Sarro

Fabrication and characterization of high aspect ratio silicon plate springs with high out-of plane stiffness

HW van Zeijl, SL Paalvast, J Su, J van Eijk, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	the 14th International Conference on Solid-State Sensors, Actuators and Microsystems
Editors	IEEE
Place of Publication	Lyon
Publisher	Transducers & Eurosensors '07
Pages	1605-1608
Number of pages	4
ISBN (Print)	1-4244-0842-3
Publication status	Published - 2007
Event	the 14th International Conference on Solid-State Sensors, Actuators and Microsystems - Lyon Duration: 10 Jun 2007 → 14 Jun 2007

Publication series

Name
Publisher	Transducers & Eurosensors '07

Conference

Conference	the 14th International Conference on Solid-State Sensors, Actuators and Microsystems
Period	10/06/07 → 14/06/07

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{b91b4ac1f3c94887837c48a98ddfd095,

title = "Fabrication and characterization of high aspect ratio silicon plate springs with high out-of plane stiffness",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "{van Zeijl}, HW and SL Paalvast and J Su and {van Eijk}, J and PM Sarro",

year = "2007",

language = "Undefined/Unknown",

isbn = "1-4244-0842-3",

publisher = "Transducers & Eurosensors '07",

pages = "1605--1608",

editor = "IEEE",

booktitle = "the 14th International Conference on Solid-State Sensors, Actuators and Microsystems",

note = "the 14th International Conference on Solid-State Sensors, Actuators and Microsystems ; Conference date: 10-06-2007 Through 14-06-2007",

}

van Zeijl, HW, Paalvast, SL, Su, J, van Eijk, J & Sarro, PM 2007, Fabrication and characterization of high aspect ratio silicon plate springs with high out-of plane stiffness. in IEEE (ed.), the 14th International Conference on Solid-State Sensors, Actuators and Microsystems. Transducers & Eurosensors '07, Lyon, pp. 1605-1608, the 14th International Conference on Solid-State Sensors, Actuators and Microsystems, 10/06/07.

Fabrication and characterization of high aspect ratio silicon plate springs with high out-of plane stiffness. / van Zeijl, HW; Paalvast, SL; Su, J et al.
the 14th International Conference on Solid-State Sensors, Actuators and Microsystems. ed. / IEEE. Lyon: Transducers & Eurosensors '07, 2007. p. 1605-1608.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Fabrication and characterization of high aspect ratio silicon plate springs with high out-of plane stiffness

AU - van Zeijl, HW

AU - Paalvast, SL

AU - Su, J

AU - van Eijk, J

AU - Sarro, PM

PY - 2007

Y1 - 2007

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 1-4244-0842-3

SP - 1605

EP - 1608

BT - the 14th International Conference on Solid-State Sensors, Actuators and Microsystems

A2 - IEEE, null

PB - Transducers & Eurosensors '07

CY - Lyon

T2 - the 14th International Conference on Solid-State Sensors, Actuators and Microsystems

Y2 - 10 June 2007 through 14 June 2007

ER -