Fabrication of through-substrate cavities for hybrid wafer-level packaging

S Sosin; J Tian; L Wang; M Bartek

Fabrication of through-substrate cavities for hybrid wafer-level packaging

S Sosin, J Tian, L Wang, M Bartek

Micro and Nano Engineering

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 9th STW Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE 2006)
Editors	s.n.
Place of Publication	Utrecht
Publisher	STW
Pages	544-547
Number of pages	4
ISBN (Print)	90-73461-44-8
Publication status	Published - 2006
Event	9th Annual Workshop on Semiconductor Advances for future Electronics and Sensors (SAFE 2006), Veldhoven, the Netherlands - Utrecht Duration: 23 Nov 2006 → 24 Nov 2006

Publication series

Name
Publisher	STW

Conference

Conference	9th Annual Workshop on Semiconductor Advances for future Electronics and Sensors (SAFE 2006), Veldhoven, the Netherlands
Period	23/11/06 → 24/11/06

Keywords

Elektrotechniek
Vakpubl., Overig wet. > 3 pag

Cite this

@inproceedings{4bd35e9a9740413683867dfebb7c1c67,

title = "Fabrication of through-substrate cavities for hybrid wafer-level packaging",

keywords = "Elektrotechniek, Vakpubl., Overig wet. > 3 pag",

author = "S Sosin and J Tian and L Wang and M Bartek",

year = "2006",

language = "Undefined/Unknown",

isbn = "90-73461-44-8",

publisher = "STW",

pages = "544--547",

editor = "s.n.",

booktitle = "Proceedings of the 9th STW Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE 2006)",

note = "9th Annual Workshop on Semiconductor Advances for future Electronics and Sensors (SAFE 2006), Veldhoven, the Netherlands ; Conference date: 23-11-2006 Through 24-11-2006",

}

Sosin, S, Tian, J, Wang, L & Bartek, M 2006, Fabrication of through-substrate cavities for hybrid wafer-level packaging. in s.n. (ed.), Proceedings of the 9th STW Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE 2006). STW, Utrecht, pp. 544-547, 9th Annual Workshop on Semiconductor Advances for future Electronics and Sensors (SAFE 2006), Veldhoven, the Netherlands, 23/11/06.

Fabrication of through-substrate cavities for hybrid wafer-level packaging. / Sosin, S; Tian, J; Wang, L et al.
Proceedings of the 9th STW Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE 2006). ed. / s.n. Utrecht: STW, 2006. p. 544-547.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Fabrication of through-substrate cavities for hybrid wafer-level packaging

AU - Sosin, S

AU - Tian, J

AU - Wang, L

AU - Bartek, M

PY - 2006

Y1 - 2006

KW - Elektrotechniek

KW - Vakpubl., Overig wet. > 3 pag

M3 - Conference contribution

SN - 90-73461-44-8

SP - 544

EP - 547

BT - Proceedings of the 9th STW Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE 2006)

A2 - s.n., null

PB - STW

CY - Utrecht

T2 - 9th Annual Workshop on Semiconductor Advances for future Electronics and Sensors (SAFE 2006), Veldhoven, the Netherlands

Y2 - 23 November 2006 through 24 November 2006

ER -