Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits

AN Chiaramonti, S Vollebregt, AW Sanders, R Ishihara, DT Read

Research output: Contribution to journalArticleScientificpeer-review

Original languageEnglish
Pages (from-to)1762-1763
Number of pages2
JournalMicroscopy and Microanalysis
Issue numberSuppl. 3
Publication statusPublished - 2014

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