Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits

AN Chiaramonti; S Vollebregt; AW Sanders; R Ishihara; DT Read

doi:10.1017/S143192761401054X

Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits

AN Chiaramonti, S Vollebregt, AW Sanders, R Ishihara, DT Read

Electronic Components, Technology and Materials

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	English
Pages (from-to)	1762-1763
Number of pages	2
Journal	Microscopy and Microanalysis
Volume	20
Issue number	Suppl. 3
DOIs	https://doi.org/10.1017/S143192761401054X
Publication status	Published - 2014

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10.1017/S143192761401054X

Cite this

@article{bd6e3be1981343fe8941798f61990fde,

title = "Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits",

author = "AN Chiaramonti and S Vollebregt and AW Sanders and R Ishihara and DT Read",

year = "2014",

doi = "10.1017/S143192761401054X",

language = "English",

volume = "20",

pages = "1762--1763",

journal = "Microscopy and Microanalysis",

issn = "1431-9276",

publisher = "Cambridge University Press",

number = "Suppl. 3",

}

Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits. / Chiaramonti, AN; Vollebregt, S; Sanders, AW et al.
In: Microscopy and Microanalysis, Vol. 20, No. Suppl. 3, 2014, p. 1762-1763.

Research output: Contribution to journal › Article › Scientific › peer-review

TY - JOUR

T1 - Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits

AU - Chiaramonti, AN

AU - Vollebregt, S

AU - Sanders, AW

AU - Ishihara, R

AU - Read, DT

PY - 2014

Y1 - 2014

U2 - 10.1017/S143192761401054X

DO - 10.1017/S143192761401054X

M3 - Article

SN - 1431-9276

VL - 20

SP - 1762

EP - 1763

JO - Microscopy and Microanalysis

JF - Microscopy and Microanalysis

IS - Suppl. 3

ER -