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Failure analysis and reliability of low-temperature-grown multi-wall carbon nanotube bundles integrated as vias in monolithic three-dimensional integrated circuits

Research output: Contribution to journal › Article › Scientific › peer-review

Original languageEnglish
Pages (from-to)1762-1763
Number of pages2
JournalMicroscopy and Microanalysis
Volume20
Issue numberSuppl. 3
DOIs
Publication statusPublished - 2014

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