Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation

J Tang; MR Curiel; SL Furcone; EGJ Reinders; CTA Revenberg; CIM Beenakker

doi:10.1109/ECTC.2015.7159691

Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation

J Tang, MR Curiel, SL Furcone, EGJ Reinders, CTA Revenberg, CIM Beenakker

Electrical Engineering, Mathematics and Computer Science

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

12 Citations (Scopus)

Original language	English
Title of host publication	Proceedings - 65th Electronic Components and Technology Conference
Editors	B Keser, H Braunisch
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Society
Pages	845-852
Number of pages	8
ISBN (Print)	978-147998609-5
DOIs	https://doi.org/10.1109/ECTC.2015.7159691
Publication status	Published - 2015
Event	ECTC 2015, San Diego, CA, USA - Piscataway, NJ, USA Duration: 26 May 2015 → 29 May 2015

Publication series

Name
Publisher	IEEE

Conference

Conference	ECTC 2015, San Diego, CA, USA
Period	26/05/15 → 29/05/15

Bibliographical note

Harvest

Access to Document

10.1109/ECTC.2015.7159691

Cite this

Tang, J., Curiel, MR., Furcone, SL., Reinders, EGJ., Revenberg, CTA., & Beenakker, CIM. (2015). Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation. In B. Keser, & H. Braunisch (Eds.), Proceedings - 65th Electronic Components and Technology Conference (pp. 845-852). IEEE Society. https://doi.org/10.1109/ECTC.2015.7159691

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title = "Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation",

author = "J Tang and MR Curiel and SL Furcone and EGJ Reinders and CTA Revenberg and CIM Beenakker",

note = "Harvest; ECTC 2015, San Diego, CA, USA ; Conference date: 26-05-2015 Through 29-05-2015",

year = "2015",

doi = "10.1109/ECTC.2015.7159691",

language = "English",

isbn = "978-147998609-5",

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Tang, J, Curiel, MR, Furcone, SL, Reinders, EGJ, Revenberg, CTA & Beenakker, CIM 2015, Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation. in B Keser & H Braunisch (eds), Proceedings - 65th Electronic Components and Technology Conference. IEEE Society, Piscataway, NJ, USA, pp. 845-852, ECTC 2015, San Diego, CA, USA, 26/05/15. https://doi.org/10.1109/ECTC.2015.7159691

Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation. / Tang, J; Curiel, MR; Furcone, SL et al.

Proceedings - 65th Electronic Components and Technology Conference. ed. / B Keser; H Braunisch. Piscataway, NJ, USA : IEEE Society, 2015. p. 845-852.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation

AU - Tang, J

AU - Curiel, MR

AU - Furcone, SL

AU - Reinders, EGJ

AU - Revenberg, CTA

AU - Beenakker, CIM

N1 - Harvest

PY - 2015

Y1 - 2015

U2 - 10.1109/ECTC.2015.7159691

DO - 10.1109/ECTC.2015.7159691

M3 - Conference contribution

SN - 978-147998609-5

SP - 845

EP - 852

BT - Proceedings - 65th Electronic Components and Technology Conference

A2 - Keser, B

A2 - Braunisch, H

PB - IEEE Society

CY - Piscataway, NJ, USA

T2 - ECTC 2015, San Diego, CA, USA

Y2 - 26 May 2015 through 29 May 2015

ER -

Tang J, Curiel MR, Furcone SL, Reinders EGJ, Revenberg CTA, Beenakker CIM. Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation. In Keser B, Braunisch H, editors, Proceedings - 65th Electronic Components and Technology Conference. Piscataway, NJ, USA: IEEE Society. 2015. p. 845-852 doi: 10.1109/ECTC.2015.7159691