Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation

J Tang, MR Curiel, SL Furcone, EGJ Reinders, CTA Revenberg, CIM Beenakker

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

9 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings - 65th Electronic Components and Technology Conference
EditorsB Keser, H Braunisch
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages845-852
Number of pages8
ISBN (Print)978-147998609-5
DOIs
Publication statusPublished - 2015
EventECTC 2015, San Diego, CA, USA - Piscataway, NJ, USA
Duration: 26 May 201529 May 2015

Publication series

Name
PublisherIEEE

Conference

ConferenceECTC 2015, San Diego, CA, USA
Period26/05/1529/05/15

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