Failure modes of wafer level thin film MEMS packages during wafer thinning

JJM Zaal, WD van Driel, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)


An increasing number of semiconductor companies have research programs related to MEMS resonators. This can be explained by the possible wide range of application areas. Many resonators operate in vacuum and sealing of the cavity can be obtained by using a Wafer Level Thin Film Package (WLTFP). To fit the MEMS-die into a small package it needs to be thinned. In this paper the effect of wafer thinning on the WLTFP is investigated by means of simulation and experiments. The effects of tape removal on WLTFP's are simulated in 2 and 3 dimensions using the cohesive zones technique. Necessary adhesive properties of the grinding foil are measured by a grinding tape peeling experiment. In 2D FE simulation damage is included to predict the most likely cracking path.
Original languageEnglish
Title of host publicationProceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010
Editors Ernst, LJ, Driel, WD, Zhang, GQ, Rodgers, P, Bailey, C, Saint Leger, O. de
Place of PublicationBordeaux, France
PublisherIEEE Society
Number of pages6
ISBN (Print)978-1-4244-7026-6
Publication statusPublished - 2010
EventEuroSimE 2010 : 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems - Bordeaux, Frankrijk, Bordeaux, France
Duration: 25 Apr 201028 Apr 2010
Conference number: 11

Publication series



ConferenceEuroSimE 2010 


  • conference contrib. refereed
  • Conf.proc. > 3 pag

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