Failure modes of wafer level thin film MEMS packages during wafer thinning

JJM Zaal, WD van Driel, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Failure modes of wafer level thin film MEMS packages during wafer thinning'. Together they form a unique fingerprint.

INIS

Material Science

Engineering