Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

Fengze Hou, Qidong Wang, Min Chen, Guoqi Zhang, Braham Ferreira, Wenbo Wang, Rui Ma, Meiying Su, Yang Song, More Authors

Research output: Contribution to journalArticleScientificpeer-review

1 Citation (Scopus)
57 Downloads (Pure)

Fingerprint Dive into the research topics of 'Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging'. Together they form a unique fingerprint.

Engineering & Materials Science