Fast preparation of ultrathin FIB lamellas for MEMs-based in situ TEM experiments

Hui Wang*, Shanggang Xiao, Qiang Xu, Tao Zhang, Henny Zandbergen

*Corresponding author for this work

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    2 Citations (Scopus)

    Abstract

    The preparation of thin lamellas by focused ion beam (FIB) for MEMS-based in situ TEM experiments is time consuming. Typically, the lamellas are of ~5μm*10μm and have a thickness less than 100nm. Here we demonstrate a fast lamellas’ preparation method using special fast cutting by FIB of samples prepared by conventional TEM sample preparation by argon ion milling or electrochemical polishing methods. This method has been applied successfully on various materials, such as ductile metallic alloy Ti68Ta27Al5, brittle ceramics K0.5Na0.5NbO3-6%LiNbO3 and semiconductor Si. The thickness of the lamellas depends on the original TEM sample.

    Original languageEnglish
    Title of host publicationMethods of Design and Characterization of Materials, Research and Development of Technological Processes
    EditorsX. Liu, Y. Han, Y Wu, G. Li, F. Pan, R. Fan
    PublisherTrans Tech Publications
    Pages722-727
    Volume850
    ISBN (Print)9783038357629
    DOIs
    Publication statusPublished - 2016
    EventChinese Materials Congress on Methods of Design and Characterization of Materials, Research and Development of Technological Processes, 2015 - Guiyang, China
    Duration: 10 Jul 201514 Jul 2015

    Publication series

    NameMaterials Science Forum
    Volume850
    ISSN (Print)02555476

    Conference

    ConferenceChinese Materials Congress on Methods of Design and Characterization of Materials, Research and Development of Technological Processes, 2015
    Country/TerritoryChina
    CityGuiyang
    Period10/07/1514/07/15

    Keywords

    • Fast lamellas preparation
    • Focused ion beam
    • HREM
    • In situ TEM heating experiments

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