INIS
finite element method
100%
light emitting diodes
100%
damage
100%
simulation
100%
fatigue
100%
assessments
100%
substrates
60%
levels
40%
power
40%
alloys
40%
connections
40%
design
20%
pcb
20%
accumulation
20%
metrics
20%
aluminium oxides
20%
thickness
20%
layers
20%
compacts
20%
thermal cycling
20%
plastics
20%
voids
20%
density
20%
heat dissipation
20%
shear strength
20%
cost
20%
performance
20%
aluminum
20%
electrical conductivity
20%
solids
20%
size
20%
Engineering
Light-Emitting Diode
100%
Chip Scale Packages
100%
Finite Element Simulation
100%
Fatigue Damage Assessment
100%
Substrates
66%
Interconnection
66%
Compact Size
33%
Heat Losses
33%
Models
33%
Finite Element Method
33%
Plastic Work
33%
Design Consideration
33%
Metrics
33%
Critical Role
33%
Electrical Conductivity
33%
Density
33%
Aluminum Substrate
33%
State Lighting
33%
Supports
33%
Fatigue Damage Accumulation
33%
Optical Performance
33%
Material Science
Finite Element Method
100%
Fatigue Damage
100%
Light-Emitting Diode
100%
Soldering Alloys
50%
Density
25%
Thermal Cycling
25%
Shear Strength
25%
Electrical Conductivity
25%
Plastics
25%
Solderability
25%
Aluminum
25%
Aluminum Oxide
25%