Fatigue disbond growth for an adhesively bonded composite joint under mixed mode I / II loading

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	Proc. SAMPE 2014 Conference and Exhibition
Editors	s.n.
Place of Publication	Seattle, WA, USA
Publisher	SAMPE
Pages	1-15
Number of pages	15
Publication status	Published - 2014
Event	SAMPE 2014 - Seattle, WA, USA Duration: 3 Jun 2014 → 4 Jun 2014

Name
Publisher	SAMPE

Conference	SAMPE 2014
Period	3/06/14 → 4/06/14

Keywords

@inproceedings{1bdb9850bc674b4880522273394e522c,

title = "Fatigue disbond growth for an adhesively bonded composite joint under mixed mode I / II loading",

keywords = "Conf.proc. > 3 pag",

author = "C. Li and T Teng and \{Yi Wan\}, Z and NG Young and G Li and CD Rans and G LaPlante",

year = "2014",

language = "English",

publisher = "SAMPE",

pages = "1--15",

editor = "s.n.",

booktitle = "Proc. SAMPE 2014 Conference and Exhibition",

note = "SAMPE 2014 ; Conference date: 03-06-2014 Through 04-06-2014",

}

TY - GEN

T1 - Fatigue disbond growth for an adhesively bonded composite joint under mixed mode I / II loading

AU - Li, C.

AU - Teng, T

AU - Yi Wan, Z

AU - Young, NG

AU - Li, G

AU - Rans, CD

AU - LaPlante, G

PY - 2014

Y1 - 2014

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 1

EP - 15

BT - Proc. SAMPE 2014 Conference and Exhibition

A2 - s.n., null

PB - SAMPE

CY - Seattle, WA, USA

T2 - SAMPE 2014

Y2 - 3 June 2014 through 4 June 2014

ER -