Abstract
This paper investigates the challenges of dark silicon that impede the performance and reliability of 3-D stacked multiprocessors. It presents a multipronged approach toward addressing the thermal issues arising from high-density integration in die stacks, spanning architectural techniques, design methodologies, and runtime temperature management. Importantly, this paper provides novel insights into the causes of hotspot formation in 3-D ICs and details a practical approach toward exploring and mitigating performance-limiting thermal behavior early in the system design flow.
Original language | English |
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Pages (from-to) | 1549-1562 |
Number of pages | 14 |
Journal | IEEE Transactions on Very Large Scale Integration (VLSI) Systems |
Volume | 25 |
Issue number | 4 |
DOIs | |
Publication status | Published - 2017 |
Keywords
- 3-D integrated circuits
- design for quality
- memory management
- multicore processing
- system-level design