Fighting Dark Silicon: Toward Realizing Efficient Thermal-Aware 3-D Stacked Multiprocessors

Sumeet S. Kumar, Amir Zjajo, Rene van Leuken

Research output: Contribution to journalArticleScientificpeer-review

2 Citations (Scopus)

Abstract

This paper investigates the challenges of dark silicon that impede the performance and reliability of 3-D stacked multiprocessors. It presents a multipronged approach toward addressing the thermal issues arising from high-density integration in die stacks, spanning architectural techniques, design methodologies, and runtime temperature management. Importantly, this paper provides novel insights into the causes of hotspot formation in 3-D ICs and details a practical approach toward exploring and mitigating performance-limiting thermal behavior early in the system design flow.
Original languageEnglish
Pages (from-to)1549-1562
Number of pages14
JournalIEEE Transactions on Very Large Scale Integration (VLSI) Systems
Volume25
Issue number4
DOIs
Publication statusPublished - 2017

Keywords

  • 3-D integrated circuits
  • design for quality
  • memory management
  • multicore processing
  • system-level design

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