TY - GEN
T1 - Finite Element Analysis and Experimental Investigation of Die-attach Fillet Influence on the Reliability of Epoxy-Based Pressure-Less Sintered Silver Joints
AU - Wang, Xinyue
AU - Chen, Haixue
AU - Yang, Zhoudong
AU - Zhang, Jing
AU - Zhang, Guoqi
AU - Liu, Pan
N1 - Green Open Access added to TU Delft Institutional Repository as part of the Taverne amendment. More information about this copyright law amendment can be found at https://www.openaccess.nl. Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
PY - 2025
Y1 - 2025
N2 - This work investigated the impact of die-attach fillet geometry on the reliability of epoxy-based pressure-less sintered silver joints. Three types of sintered silver samples (Ag-0, Ag-1, and Ag-2) with 0%, 1%, and 2% epoxy content were prepared and characterized. Nanoindentation tests combined with inverse calculations were used to determine their elasto-plastic behavior. Fillet formation was influenced by organic solvent composition, dispense volume, and placement pressure, resulting in three geometries: rounded, triangular, and rounded rectangular. Finite element analysis was employed to simulate stress distribution and equivalent thermal strain under thermal cycling conditions (−55°C to 150°C). The simulation results were validated experimentally through shear strength testing and microstructural characterization using scanning electron microscopy (SEM). The findings highlight the significant role of fillet geometry, climbing height, and die-attach thickness in stress distribution and failure mechanisms, providing valuable insights into optimizing the die-attach process to enhance joint reliability in power electronics applications.
AB - This work investigated the impact of die-attach fillet geometry on the reliability of epoxy-based pressure-less sintered silver joints. Three types of sintered silver samples (Ag-0, Ag-1, and Ag-2) with 0%, 1%, and 2% epoxy content were prepared and characterized. Nanoindentation tests combined with inverse calculations were used to determine their elasto-plastic behavior. Fillet formation was influenced by organic solvent composition, dispense volume, and placement pressure, resulting in three geometries: rounded, triangular, and rounded rectangular. Finite element analysis was employed to simulate stress distribution and equivalent thermal strain under thermal cycling conditions (−55°C to 150°C). The simulation results were validated experimentally through shear strength testing and microstructural characterization using scanning electron microscopy (SEM). The findings highlight the significant role of fillet geometry, climbing height, and die-attach thickness in stress distribution and failure mechanisms, providing valuable insights into optimizing the die-attach process to enhance joint reliability in power electronics applications.
KW - die-attach fillet
KW - epoxy-based sintered silver
KW - finite element analysis
KW - reliability
KW - thermal cycling test
UR - http://www.scopus.com/inward/record.url?scp=105007412825&partnerID=8YFLogxK
U2 - 10.1109/EuroSimE65125.2025.11006635
DO - 10.1109/EuroSimE65125.2025.11006635
M3 - Conference contribution
AN - SCOPUS:105007412825
T3 - Proceedings - 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2025
BT - Proceedings - 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2025
PB - IEEE
T2 - 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2025
Y2 - 6 April 2025 through 9 April 2025
ER -