Finite Element Analysis of Power Module Packages with One-step Molding for Power Inductors

Xiao Li; Jiuyang  Tang; Jiayan  Zhao; Jinbing  Li; Guoqi Zhang; Pan Liu

doi:10.1109/ICEPT56209.2022.9873343

Finite Element Analysis of Power Module Packages with One-step Molding for Power Inductors

Xiao Li, Jiuyang Tang, Jiayan Zhao, Jinbing Li, Guoqi Zhang, Pan Liu^*

^*Corresponding author for this work

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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Abstract

With the development of 5G communication technology and the rise of power semiconductors, the switching frequency of the circuit keeps increasing, which pushes for miniaturization of power modules and related components. Therefore, in this paper, a one-step molding technology was proposed for a DC/DC buck converter power module. We proposed a method of using Soft Magnetic Powder filled Epoxy (SMPE) adhesive as a molding material to encapsulate a power module, which is a DC/DC buck converter power module contains several passive components, 1 power inductor, and a high-efficiency switching regulator with two integrated N-channel MOSFETs. On the basis of Finite Element Method (FEM), models were firstly established with component level moldings and checked with actual module samples for calibration. Based on the calibrated model, inductors without component level molding were then simulated. SMPE with 4~7μm insulated carbonyl ferrous powder were prepared and measured the magnetic relative permeability. Such material was investigated to pot the whole power module as a one-step molding, instead of separate molding for the power inductor and the power module. After that, thermal analysis and inductance were calculated and compared.

Original language	English
Title of host publication	Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
Publisher	IEEE
Pages	1-5
Number of pages	5
ISBN (Electronic)	978-1-6654-9905-7
ISBN (Print)	978-1-6654-9906-4
DOIs	https://doi.org/10.1109/ICEPT56209.2022.9873343
Publication status	Published - 2022
Event	2022 23rd International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China Duration: 10 Aug 2022 → 13 Aug 2022 Conference number: 23rd

Conference

Conference	2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
Country/Territory	China
City	Dalian
Period	10/08/22 → 13/08/22

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

Finite element simulation
Power module packaging
Relative Permeability
Thermal management

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Finite_Element_Analysis_of_Power_Module_Packages_with_One-step_Molding_for_Power_InductorsFinal published version, 3.29 MB

Cite this

@inproceedings{ddbcfa3063224b50aad3d61e386e5eec,

title = "Finite Element Analysis of Power Module Packages with One-step Molding for Power Inductors",

abstract = "With the development of 5G communication technology and the rise of power semiconductors, the switching frequency of the circuit keeps increasing, which pushes for miniaturization of power modules and related components. Therefore, in this paper, a one-step molding technology was proposed for a DC/DC buck converter power module. We proposed a method of using Soft Magnetic Powder filled Epoxy (SMPE) adhesive as a molding material to encapsulate a power module, which is a DC/DC buck converter power module contains several passive components, 1 power inductor, and a high-efficiency switching regulator with two integrated N-channel MOSFETs. On the basis of Finite Element Method (FEM), models were firstly established with component level moldings and checked with actual module samples for calibration. Based on the calibrated model, inductors without component level molding were then simulated. SMPE with 4~7μm insulated carbonyl ferrous powder were prepared and measured the magnetic relative permeability. Such material was investigated to pot the whole power module as a one-step molding, instead of separate molding for the power inductor and the power module. After that, thermal analysis and inductance were calculated and compared.",

keywords = "Finite element simulation, Power module packaging, Relative Permeability, Thermal management",

author = "Xiao Li and Jiuyang Tang and Jiayan Zhao and Jinbing Li and Guoqi Zhang and Pan Liu",

note = "Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.; 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ; Conference date: 10-08-2022 Through 13-08-2022",

year = "2022",

doi = "10.1109/ICEPT56209.2022.9873343",

language = "English",

isbn = "978-1-6654-9906-4",

pages = "1--5",

booktitle = "Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)",

publisher = "IEEE",

address = "United States",

}

Li, X, Tang, J, Zhao, J, Li, J, Zhang, G & Liu, P 2022, Finite Element Analysis of Power Module Packages with One-step Molding for Power Inductors. in Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). IEEE, pp. 1-5, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), Dalian, China, 10/08/22. https://doi.org/10.1109/ICEPT56209.2022.9873343

Finite Element Analysis of Power Module Packages with One-step Molding for Power Inductors. / Li, Xiao; Tang, Jiuyang ; Zhao, Jiayan et al.
Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2022. p. 1-5.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Finite Element Analysis of Power Module Packages with One-step Molding for Power Inductors

AU - Li, Xiao

AU - Tang, Jiuyang

AU - Zhao, Jiayan

AU - Li, Jinbing

AU - Zhang, Guoqi

AU - Liu, Pan

N1 - Conference code: 23rd

PY - 2022

Y1 - 2022

N2 - With the development of 5G communication technology and the rise of power semiconductors, the switching frequency of the circuit keeps increasing, which pushes for miniaturization of power modules and related components. Therefore, in this paper, a one-step molding technology was proposed for a DC/DC buck converter power module. We proposed a method of using Soft Magnetic Powder filled Epoxy (SMPE) adhesive as a molding material to encapsulate a power module, which is a DC/DC buck converter power module contains several passive components, 1 power inductor, and a high-efficiency switching regulator with two integrated N-channel MOSFETs. On the basis of Finite Element Method (FEM), models were firstly established with component level moldings and checked with actual module samples for calibration. Based on the calibrated model, inductors without component level molding were then simulated. SMPE with 4~7μm insulated carbonyl ferrous powder were prepared and measured the magnetic relative permeability. Such material was investigated to pot the whole power module as a one-step molding, instead of separate molding for the power inductor and the power module. After that, thermal analysis and inductance were calculated and compared.

AB - With the development of 5G communication technology and the rise of power semiconductors, the switching frequency of the circuit keeps increasing, which pushes for miniaturization of power modules and related components. Therefore, in this paper, a one-step molding technology was proposed for a DC/DC buck converter power module. We proposed a method of using Soft Magnetic Powder filled Epoxy (SMPE) adhesive as a molding material to encapsulate a power module, which is a DC/DC buck converter power module contains several passive components, 1 power inductor, and a high-efficiency switching regulator with two integrated N-channel MOSFETs. On the basis of Finite Element Method (FEM), models were firstly established with component level moldings and checked with actual module samples for calibration. Based on the calibrated model, inductors without component level molding were then simulated. SMPE with 4~7μm insulated carbonyl ferrous powder were prepared and measured the magnetic relative permeability. Such material was investigated to pot the whole power module as a one-step molding, instead of separate molding for the power inductor and the power module. After that, thermal analysis and inductance were calculated and compared.

KW - Finite element simulation

KW - Power module packaging

KW - Relative Permeability

KW - Thermal management

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DO - 10.1109/ICEPT56209.2022.9873343

M3 - Conference contribution

SN - 978-1-6654-9906-4

SP - 1

EP - 5

BT - Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

PB - IEEE

T2 - 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

Y2 - 10 August 2022 through 13 August 2022

ER -

Finite Element Analysis of Power Module Packages with One-step Molding for Power Inductors

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Keywords

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