Finite Element Optimization of Thermal-Mechanical Coupling in Smart P2 Packagingaging Frontal Interconnects

Xiaowe i Zhang; Jieming  Lin; Shenglin  Zhang; Xu Liu; Peng  Ding; Guoshuai Liu; Yuqi  Wang; Shaogang Wang; Lingen Wang; Renhui  Liu; Chenshan Gao; Huaiyu Ye

doi:10.1109/ICEPT67137.2025.11157012

Finite Element Optimization of Thermal-Mechanical Coupling in Smart P2 Packagingaging Frontal Interconnects

Xiaowe i Zhang , Jieming Lin, Shenglin Zhang, Xu Liu, Peng Ding, Guoshuai Liu, Yuqi Wang, Shaogang Wang, Lingen Wang, Renhui Liu , Chenshan Gao, Huaiyu Ye

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Abstract

With the rapid advancement of power semiconductor packaging technologies, Smart P2 Packagingaging has emerged as a pivotal innovation for enhancing system performance and miniaturization. This study systematically investigates the thermal conduction characteristics and stress distributions of copper-filled vias (CFVs) in Smart P2Pack frontal interconnects through coupled thermal-mechanical finite element analysis. Results indicate that increasing CFV diameter enhances vertical heat conduction but causes localized heat accumulation and stress concentration due to the low thermal conductivity of encapsulation materials, elevating interfacial failure risks. Conversely, expanding CFV pitch promotes dispersed heat flow and reduces chip temperature but concurrently lowers local structural stiffness and exacerbates stress concentration. Optimal CFV design thus requires balancing thermal diffusion performance and mechanical constraints to ensure structural reliability and thermal stability.

Original language	English
Title of host publication	Proceedings of the 2025 26th International Conference on Electronic Packaging Technology (ICEPT)
Publisher	IEEE
Number of pages	5
Edition	2025
ISBN (Electronic)	978-1-6654-6580-9
ISBN (Print)	978-1-6654-7736-9
DOIs	https://doi.org/10.1109/ICEPT67137.2025.11157012
Publication status	Published - 2025
Event	2025 26th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China Duration: 5 Aug 2025 → 7 Aug 2025 Conference number: 26th

Conference

Conference	2025 26th International Conference on Electronic Packaging Technology (ICEPT)
Country/Territory	China
City	Shanghai
Period	5/08/25 → 7/08/25

Bibliographical note

Green Open Access added to TU Delft Institutional Repository as part of the Taverne amendment. More information about this copyright law amendment can be found at https://www.openaccess.nl. Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

Smart P2 Packagingaging
Thermal-mechanical coupling
Copper-filled vias

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10.1109/ICEPT67137.2025.11157012

Cite this

i Zhang , X., Lin, J., Zhang, S., Liu, X., Ding, P., Liu, G., Wang, Y., Wang, S., Wang, L., Liu , R., Gao, C., & Ye, H. (2025). Finite Element Optimization of Thermal-Mechanical Coupling in Smart P2 Packagingaging Frontal Interconnects. In Proceedings of the 2025 26th International Conference on Electronic Packaging Technology (ICEPT) (2025 ed.). IEEE. https://doi.org/10.1109/ICEPT67137.2025.11157012

@inproceedings{ba63758bcb884d0ea0a353b53c5c6399,

title = "Finite Element Optimization of Thermal-Mechanical Coupling in Smart P2 Packagingaging Frontal Interconnects",

abstract = "With the rapid advancement of power semiconductor packaging technologies, Smart P2 Packagingaging has emerged as a pivotal innovation for enhancing system performance and miniaturization. This study systematically investigates the thermal conduction characteristics and stress distributions of copper-filled vias (CFVs) in Smart P2Pack frontal interconnects through coupled thermal-mechanical finite element analysis. Results indicate that increasing CFV diameter enhances vertical heat conduction but causes localized heat accumulation and stress concentration due to the low thermal conductivity of encapsulation materials, elevating interfacial failure risks. Conversely, expanding CFV pitch promotes dispersed heat flow and reduces chip temperature but concurrently lowers local structural stiffness and exacerbates stress concentration. Optimal CFV design thus requires balancing thermal diffusion performance and mechanical constraints to ensure structural reliability and thermal stability.",

keywords = "Smart P2 Packagingaging, Thermal-mechanical coupling, Copper-filled vias",

author = "{i Zhang}, Xiaowe and Jieming Lin and Shenglin Zhang and Xu Liu and Peng Ding and Guoshuai Liu and Yuqi Wang and Shaogang Wang and Lingen Wang and Renhui Liu and Chenshan Gao and Huaiyu Ye",

note = "Green Open Access added to TU Delft Institutional Repository as part of the Taverne amendment. More information about this copyright law amendment can be found at https://www.openaccess.nl. Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.; 2025 26th International Conference on Electronic Packaging Technology (ICEPT) ; Conference date: 05-08-2025 Through 07-08-2025",

year = "2025",

doi = "10.1109/ICEPT67137.2025.11157012",

language = "English",

isbn = "978-1-6654-7736-9",

booktitle = "Proceedings of the 2025 26th International Conference on Electronic Packaging Technology (ICEPT)",

publisher = "IEEE",

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edition = "2025",

}

i Zhang , X, Lin, J, Zhang, S, Liu, X, Ding, P, Liu, G, Wang, Y, Wang, S, Wang, L, Liu , R, Gao, C & Ye, H 2025, Finite Element Optimization of Thermal-Mechanical Coupling in Smart P2 Packagingaging Frontal Interconnects. in Proceedings of the 2025 26th International Conference on Electronic Packaging Technology (ICEPT). 2025 edn, IEEE, 2025 26th International Conference on Electronic Packaging Technology (ICEPT), Shanghai, China, 5/08/25. https://doi.org/10.1109/ICEPT67137.2025.11157012

Finite Element Optimization of Thermal-Mechanical Coupling in Smart P2 Packagingaging Frontal Interconnects. / i Zhang , Xiaowe; Lin, Jieming; Zhang, Shenglin et al.
Proceedings of the 2025 26th International Conference on Electronic Packaging Technology (ICEPT). 2025. ed. IEEE, 2025.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Finite Element Optimization of Thermal-Mechanical Coupling in Smart P2 Packagingaging Frontal Interconnects

AU - i Zhang , Xiaowe

AU - Lin, Jieming

AU - Zhang, Shenglin

AU - Liu, Xu

AU - Ding, Peng

AU - Liu, Guoshuai

AU - Wang, Yuqi

AU - Wang, Shaogang

AU - Wang, Lingen

AU - Liu , Renhui

AU - Gao, Chenshan

AU - Ye, Huaiyu

N1 - Conference code: 26th

PY - 2025

Y1 - 2025

N2 - With the rapid advancement of power semiconductor packaging technologies, Smart P2 Packagingaging has emerged as a pivotal innovation for enhancing system performance and miniaturization. This study systematically investigates the thermal conduction characteristics and stress distributions of copper-filled vias (CFVs) in Smart P2Pack frontal interconnects through coupled thermal-mechanical finite element analysis. Results indicate that increasing CFV diameter enhances vertical heat conduction but causes localized heat accumulation and stress concentration due to the low thermal conductivity of encapsulation materials, elevating interfacial failure risks. Conversely, expanding CFV pitch promotes dispersed heat flow and reduces chip temperature but concurrently lowers local structural stiffness and exacerbates stress concentration. Optimal CFV design thus requires balancing thermal diffusion performance and mechanical constraints to ensure structural reliability and thermal stability.

AB - With the rapid advancement of power semiconductor packaging technologies, Smart P2 Packagingaging has emerged as a pivotal innovation for enhancing system performance and miniaturization. This study systematically investigates the thermal conduction characteristics and stress distributions of copper-filled vias (CFVs) in Smart P2Pack frontal interconnects through coupled thermal-mechanical finite element analysis. Results indicate that increasing CFV diameter enhances vertical heat conduction but causes localized heat accumulation and stress concentration due to the low thermal conductivity of encapsulation materials, elevating interfacial failure risks. Conversely, expanding CFV pitch promotes dispersed heat flow and reduces chip temperature but concurrently lowers local structural stiffness and exacerbates stress concentration. Optimal CFV design thus requires balancing thermal diffusion performance and mechanical constraints to ensure structural reliability and thermal stability.

KW - Smart P2 Packagingaging

KW - Thermal-mechanical coupling

KW - Copper-filled vias

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U2 - 10.1109/ICEPT67137.2025.11157012

DO - 10.1109/ICEPT67137.2025.11157012

M3 - Conference contribution

SN - 978-1-6654-7736-9

BT - Proceedings of the 2025 26th International Conference on Electronic Packaging Technology (ICEPT)

PB - IEEE

T2 - 2025 26th International Conference on Electronic Packaging Technology (ICEPT)

Y2 - 5 August 2025 through 7 August 2025

ER -

Finite Element Optimization of Thermal-Mechanical Coupling in Smart P2 Packagingaging Frontal Interconnects

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