Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations

P Gromala, C Silber, KMB Jansen, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings of the16th Electronic Packaging Technology Conference - 2014
EditorsA Yeo, NG Hong Wan
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages411-420
Number of pages10
ISBN (Print)978-1-4799-6994-4
Publication statusPublished - 2014
EventEPTC 2014, Marina Bay Sands, Singapore - Piscataway, NJ, USA
Duration: 3 Dec 20145 Dec 2014

Publication series

Name
PublisherIEEE

Conference

ConferenceEPTC 2014, Marina Bay Sands, Singapore
Period3/12/145/12/14

Cite this

Gromala, P., Silber, C., Jansen, KMB., & Ernst, LJ. (2014). Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations. In A. Yeo, & NG. Hong Wan (Eds.), Proceedings of the16th Electronic Packaging Technology Conference - 2014 (pp. 411-420). IEEE Society.