First steps towards a design for impact resistance method

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Proceedings of 24th IAPRI Symposium on Packaging
Editors	K Cooksey, D Jordan
Place of Publication	Clemson
Publisher	Clemson University
Pages	1-7
Number of pages	7
Publication status	Published - 2009
Event	24th IAPRI Symposium on Packaging, Greenville, USA - Clemson Duration: 17 May 2009 → 20 May 2009

Name
Publisher	Dept. of Packaging Science, Clemson University

Conference	24th IAPRI Symposium on Packaging, Greenville, USA
Period	17/05/09 → 20/05/09

Keywords

@inproceedings{e5724a528e774be9bdea42ad092fd971,

title = "First steps towards a design for impact resistance method",

keywords = "Conf.proc. > 3 pag",

author = "E Tempelman and R Wever",

year = "2009",

language = "Undefined/Unknown",

publisher = "Clemson University",

pages = "1--7",

editor = "K Cooksey and D Jordan",

booktitle = "Proceedings of 24th IAPRI Symposium on Packaging",

note = "24th IAPRI Symposium on Packaging, Greenville, USA ; Conference date: 17-05-2009 Through 20-05-2009",

}

TY - GEN

T1 - First steps towards a design for impact resistance method

AU - Tempelman, E

AU - Wever, R

PY - 2009

Y1 - 2009

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 1

EP - 7

BT - Proceedings of 24th IAPRI Symposium on Packaging

A2 - Cooksey, K

A2 - Jordan, D

PB - Clemson University

CY - Clemson

T2 - 24th IAPRI Symposium on Packaging, Greenville, USA

Y2 - 17 May 2009 through 20 May 2009

ER -