Flexible interconnects for deformable ultra-thin substrates

T Zoumpoulidis, L WANG, M Bartek, KMB Jansen, A Polyakov, S Sosin, LJ Ernst, R. Dekker, JN Burghartz

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

4 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationProc. 39th International Symposium on Microelectronics
Editors s.n.
Place of PublicationWashington
PublisherIMAPS
Pages204-210
Number of pages7
ISBN (Print)0-930815-80-7
Publication statusPublished - 2006
Event39th International Symposium on Microelectronics (IMAPS 2006), San Diego, CA - Washington
Duration: 9 Oct 200613 Oct 2006

Publication series

Name
PublisherIMAPS

Conference

Conference39th International Symposium on Microelectronics (IMAPS 2006), San Diego, CA
Period9/10/0613/10/06

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

Cite this

Zoumpoulidis, T., WANG, L., Bartek, M., Jansen, KMB., Polyakov, A., Sosin, S., Ernst, LJ., Dekker, R., & Burghartz, JN. (2006). Flexible interconnects for deformable ultra-thin substrates. In s.n. (Ed.), Proc. 39th International Symposium on Microelectronics (pp. 204-210). IMAPS.