Abstract
Flexible devices can be fabricated using organic materials which are made electrically active, or in semiconductors. Silicon is usually seen as a stiff material. However, the active part of the device is often only the top few microns and the rest of the device is for mechanical support. If we remove this bulk, we have a flexible devices, which can lead to many advantages. Recent years have seen the development of devices such as flexible displays and flexible sensors. Many of these devices use a combination of silicon, metals and polymers. This paper looks into the processing to fabricate these flexible devices and also the applications.
| Original language | English |
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| Title of host publication | Smart Systems Integration 2016 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, SSI 2016 |
| Editors | T. Gessner |
| Publisher | Verlag Wissenschaftliche Scripten |
| Pages | 181-188 |
| Number of pages | 8 |
| ISBN (Electronic) | 978-395735040-4 |
| Publication status | Published - 2016 |
| Event | Smart Systems Integration 2016: International Conference and Exhibition on Integration Issues of Miniaturized Systems - Munich, Germany Duration: 9 Mar 2016 → 10 Mar 2016 |
Conference
| Conference | Smart Systems Integration 2016 |
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| Abbreviated title | SSI 2016 |
| Country/Territory | Germany |
| City | Munich |
| Period | 9/03/16 → 10/03/16 |