Flexible system for real-time plasma decapsulation of copper wire bonded ic packages

J Tang, JBJ Schelen, CIM Beenakker

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

7 Citations (Scopus)
Original languageEnglish
Title of host publicationElectronic components and technology conference
EditorsD McCann
Place of Publications.l.
PublisherIEEE Society
Pages1764-1769
Number of pages6
ISBN (Print)978-146731966-9
DOIs
Publication statusPublished - 2012
EventIEEE 62nd electronic components and technology conference ECTC, San Diego, USA - s.l.
Duration: 29 May 20121 Jun 2012

Publication series

Name
PublisherIEEE

Conference

ConferenceIEEE 62nd electronic components and technology conference ECTC, San Diego, USA
Period29/05/121/06/12

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