@inproceedings{01b970005ba14e909e4a06afa49f7575,
title = "Flexible system for real-time plasma decapsulation of copper wire bonded ic packages",
author = "J Tang and JBJ Schelen and CIM Beenakker",
note = "harvest; IEEE 62nd electronic components and technology conference ECTC, San Diego, USA ; Conference date: 29-05-2012 Through 01-06-2012",
year = "2012",
doi = "10.1109/ECTC.2012.6249076",
language = "English",
isbn = "978-146731966-9",
publisher = "IEEE Society",
pages = "1764--1769",
editor = "D McCann",
booktitle = "Electronic components and technology conference",
}