Original language | English |
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Pages (from-to) | 4954-4959 |
Number of pages | 6 |
Journal | Journal of Materials Science: Materials in Electronics |
Volume | 25 |
Issue number | 11 |
DOIs | |
Publication status | Published - 2014 |
Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
Y Liu, JC Meerwijk, L Luo, H Zhang, F Sun, CA Yuan, GQ Zhang
Research output: Contribution to journal › Article › Scientific › peer-review
14
Citations
(Scopus)