Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

Y Liu, JC Meerwijk, L Luo, H Zhang, F Sun, CA Yuan, GQ Zhang

Research output: Contribution to journalArticleScientificpeer-review

14 Citations (Scopus)
Original languageEnglish
Pages (from-to)4954-4959
Number of pages6
JournalJournal of Materials Science: Materials in Electronics
Issue number11
Publication statusPublished - 2014

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