@article{b1bd5b92f7e04cf1a4f8633a13b83a53,
title = "Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging",
author = "Y Liu and JC Meerwijk and L Luo and H Zhang and F Sun and CA Yuan and GQ Zhang",
note = "Harvest",
year = "2014",
doi = "10.1007/s10854-014-2257-8",
language = "English",
volume = "25",
pages = "4954--4959",
journal = "Journal of Materials Science: Materials in Electronics",
issn = "0957-4522",
publisher = "Springer",
number = "11",
}