Fracture behaviour of functionally graded bi-material interface produced by wire arc additive manufacturing

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Abstract

Wire arc additive manufacturing (WAAM) offers a novel approach to fabricate functionally graded components. By changing the wire consumable between layers, chemical grading can be used to obtain specific properties across a part's volume. This is an interesting approach to design large metal components that achieve unconventional performance in demanding engineering applications, such as sulphide-resistant pressure vessels or sea ballast piping with extended lifetime. However, challenges derived from dissimilar material combinations draw the need to study the effect of compositional grading on the mechanical properties. This study focuses on the deformation and fracture toughness behaviour of WAAM-fabricated high-strength low-alloy (HSLA) and austenitic stainless (AS) steel bi-material specimens, particularly examining the diluted interface layer obtained during deposition. Tensile testing results indicate that the elastic modulus at the interface matches that of un-diluted AS steel (157 ±17 GPa) along the build direction. Fracture toughness showed a lower JIC (180 kJ/m2) when compared to the undiluted AS steel (459 ±69 kJ/m2) and HSLA steel (408 ±25 kJ/m2). Scanning electron microscopy and electron backscatter diffraction are used to establish a connection between the microstructure at the interface and the observed mechanical properties. It is concluded that deformation at the interface is in large controlled by the deformation-induced martensitic transformation of metastable austenite. These results underline the influence of chemical dilution on the deformation mechanisms and fracture behaviour of HSLA and AS steel bi-material parts, which needs to be accounted for in the design of parts composed by this bi-metal couple.

Original languageEnglish
Article number148034
Number of pages24
JournalMaterials Science and Engineering: A
Volume928
DOIs
Publication statusPublished - 2025

Keywords

  • Bi-material interface
  • Fracture toughness
  • Functionally graded material
  • Wire arc additive manufacturing

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