Free-standing, parylene-sealed copper interconnect for stretchable silicon electronics

S Sosin, T Zoumpoulidis, M Bartek, L Wang, R Dekker, KMB Jansen, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

13 Citations (Scopus)


In this paper, development and characterization of a free-standing electroplated copper interconnect for applications in flexible and stretchable electronics is presented. The copper layer with typical thickness of 5 µm is plated into a photoresist mould realizing meander and mesh-like patterns. These are subsequently released resulting in a free-standing electrical interconnect that is optionally conformally coated by a -8 µm thick Parylene N layer. Parylene sealing provides electrical insulation and increases rigidity of the structures. Tensile tests on fabricated samples have shown the elongation capability up to 300% for the mesh design and more than 1000% for the meander design. The Parylene coated samples showed increased rigidity but about 50% reduced elongation. Furthermore, parameterized FEM simulations were performed in order to estimate stress levels for different geometries under tensile stress.
Original languageUndefined/Unknown
Title of host publication2008 proceedings 58th electronic components & technology conference, Lake Buena Vista, FL, USA
Editors Wipiejewski, T., Trewhella, J.
Place of PublicationOrlando, FL, USA
PublisherIEEE Society
Number of pages7
ISBN (Print)978-1-4244-2231-9
Publication statusPublished - 2008
Event58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA - Orlando, FL, USA
Duration: 27 May 200830 May 2008

Publication series



Conference58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA


  • conference contrib. refereed
  • Conf.proc. > 3 pag

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