From Si Towards SiC Technology for Harsh Environment Sensing

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Abstract

In the coming decade, the development in the area of More than Moore will certainly take over from Moore’s Law. Sensor development and sensor integration will prevail above lower node development. New packaging solutions will be developed which will fuel the integration of sensors. These developments can still be silicon based but where harsh environments are involved wide-bandgap (WBG) materials, such as gallium nitride (GaN) or silicon carbide (SiC), will take over the development efforts spend. In this chapter, the use of WBG SiC material is discussed and reviewed towards possible applications for sensing under harsh environment exposure.
Original languageEnglish
Title of host publicationSensor Systems Simulations: From Concept to Solution
EditorsWillem Dirk van Driel, Oliver Pyper, Cornelia Schumann
PublisherSpringer
Pages1-15
Number of pages15
ISBN (Electronic)978-3-030-16577-2
ISBN (Print)978-3-030-16576-5
DOIs
Publication statusPublished - 2020

Bibliographical note

Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

  • Sensor integration
  • More than Moore
  • Harsh environments
  • WBG
  • SiC

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