Front-to back-side overlay optimization after wafer bonding for 3D integration

WD van Noort; L Marinier; R Pellens; B Sutedja; R. Dekker; HW van Zeijl

Front-to back-side overlay optimization after wafer bonding for 3D integration

WD van Noort, L Marinier, R Pellens, B Sutedja, R. Dekker, HW van Zeijl

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 31st international conference of micro- and nano-engineering 2005
Editors	s.n.
Place of Publication	Amsterdam
Publisher	Elsevier
Pages	1-4
Number of pages	4
Publication status	Published - 2005
Event	MNE 2005, 31st International Conference on Micro- and Nano-Engineering, Vienna, Austria - Amsterdam Duration: 19 Sept 2005 → 22 Sept 2005

Publication series

Name
Publisher	Elsevier

Conference

Conference	MNE 2005, 31st International Conference on Micro- and Nano-Engineering, Vienna, Austria
Period	19/09/05 → 22/09/05

Bibliographical note

Editors & ISBN onbekend

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{0b773c45f63140c0a76cb7df5553d565,

title = "Front-to back-side overlay optimization after wafer bonding for 3D integration",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "{van Noort}, WD and L Marinier and R Pellens and B Sutedja and R. Dekker and {van Zeijl}, HW",

note = "Editors & ISBN onbekend; MNE 2005, 31st International Conference on Micro- and Nano-Engineering, Vienna, Austria ; Conference date: 19-09-2005 Through 22-09-2005",

year = "2005",

language = "Undefined/Unknown",

publisher = "Elsevier",

pages = "1--4",

editor = "s.n.",

booktitle = "Proceedings of the 31st international conference of micro- and nano-engineering 2005",

}

van Noort, WD, Marinier, L, Pellens, R, Sutedja, B, Dekker, R & van Zeijl, HW 2005, Front-to back-side overlay optimization after wafer bonding for 3D integration. in s.n. (ed.), Proceedings of the 31st international conference of micro- and nano-engineering 2005. Elsevier, Amsterdam, pp. 1-4, MNE 2005, 31st International Conference on Micro- and Nano-Engineering, Vienna, Austria, 19/09/05.

Front-to back-side overlay optimization after wafer bonding for 3D integration. / van Noort, WD; Marinier, L; Pellens, R et al.
Proceedings of the 31st international conference of micro- and nano-engineering 2005. ed. / s.n. Amsterdam: Elsevier, 2005. p. 1-4.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Front-to back-side overlay optimization after wafer bonding for 3D integration

AU - van Noort, WD

AU - Marinier, L

AU - Pellens, R

AU - Sutedja, B

AU - Dekker, R.

AU - van Zeijl, HW

N1 - Editors & ISBN onbekend

PY - 2005

Y1 - 2005

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 1

EP - 4

BT - Proceedings of the 31st international conference of micro- and nano-engineering 2005

A2 - s.n., null

PB - Elsevier

CY - Amsterdam

T2 - MNE 2005, 31st International Conference on Micro- and Nano-Engineering, Vienna, Austria

Y2 - 19 September 2005 through 22 September 2005

ER -