Front-to back-side overlay optimization after wafer bonding for 3D integration

WD van Noort, L Marinier, R Pellens, B Sutedja, R. Dekker, HW van Zeijl

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationProceedings of the 31st international conference of micro- and nano-engineering 2005
Editors s.n.
Place of PublicationAmsterdam
PublisherElsevier
Pages1-4
Number of pages4
Publication statusPublished - 2005
EventMNE 2005, 31st International Conference on Micro- and Nano-Engineering, Vienna, Austria - Amsterdam
Duration: 19 Sep 200522 Sep 2005

Publication series

Name
PublisherElsevier

Conference

ConferenceMNE 2005, 31st International Conference on Micro- and Nano-Engineering, Vienna, Austria
Period19/09/0522/09/05

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

Cite this