Front-to back-wafer overlay accuracy in substrate transfer technologies

HW van Zeijl, JHCM Slabbekoorn

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Semiconductor Technology (ISTC2001), Proceedings
Place of Publication	New Jersey
Publisher	The Electrochemical Society
Pages	356-367
Number of pages	12
ISBN (Print)	1-56677-324-5
Publication status	Published - 2001
Event	1st International Conference on Semiconductor Technology, Shanghai - New Jersey Duration: 27 May 2001 → 30 May 2001

Name
Publisher	the Electrochemical Society

Conference	1st International Conference on Semiconductor Technology, Shanghai
Period	27/05/01 → 30/05/01

Keywords

@inproceedings{6d9c790008754b0fb76f43cee8d98f15,

title = "Front-to back-wafer overlay accuracy in substrate transfer technologies",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "{van Zeijl}, HW and JHCM Slabbekoorn",

year = "2001",

language = "Undefined/Unknown",

isbn = "1-56677-324-5",

publisher = "The Electrochemical Society",

pages = "356--367",

booktitle = "Semiconductor Technology (ISTC2001), Proceedings",

note = "1st International Conference on Semiconductor Technology, Shanghai ; Conference date: 27-05-2001 Through 30-05-2001",

}

TY - GEN

T1 - Front-to back-wafer overlay accuracy in substrate transfer technologies

AU - van Zeijl, HW

AU - Slabbekoorn, JHCM

PY - 2001

Y1 - 2001

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SN - 1-56677-324-5

SP - 356

EP - 367

BT - Semiconductor Technology (ISTC2001), Proceedings

PB - The Electrochemical Society

CY - New Jersey

T2 - 1st International Conference on Semiconductor Technology, Shanghai

Y2 - 27 May 2001 through 30 May 2001

ER -