Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

F Santagata, G Fiorentino, M Nie, C Farriciello, RH Poelma, GQ Zhang, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)
Original languageEnglish
Title of host publicationProceedings 11th IEEE Sensors Conference
EditorsW Fang et al
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages668-671
Number of pages4
Publication statusPublished - 2012
EventIEEE Sensors 2012: 11th IEEE Sensors Conference - Taipei, Taiwan
Duration: 28 Oct 201231 Oct 2012

Publication series

Name
PublisherIEEE

Conference

ConferenceIEEE Sensors 2012
Country/TerritoryTaiwan
CityTaipei
Period28/10/1231/10/12

Bibliographical note

Onder dezelfde titel als artikel van 11 blz. in 2013 verschenen in J. Micromech. Microeng; met verschillende auteurs.

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

Cite this