Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems

F Santagata, G Fiorentino, M Nie, C Farriciello, RH Poelma, GQ Zhang, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)
Original languageEnglish
Title of host publicationProceedings 11th IEEE Sensors Conference
EditorsW Fang et al
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages668-671
Number of pages4
Publication statusPublished - 2012
EventIEEE Sensors 2012: 11th IEEE Sensors Conference - Taipei, Taiwan
Duration: 28 Oct 201231 Oct 2012

Publication series

Name
PublisherIEEE

Conference

ConferenceIEEE Sensors 2012
CountryTaiwan
CityTaipei
Period28/10/1231/10/12

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

Cite this

Santagata, F., Fiorentino, G., Nie, M., Farriciello, C., Poelma, RH., Zhang, GQ., & Sarro, PM. (2012). Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems. In W. Fang et al (Ed.), Proceedings 11th IEEE Sensors Conference (pp. 668-671). IEEE Society.