@inproceedings{6ad6f3b924964a43891e669acf8d914a,
title = "Fully back-end TSV process by Cu electro-less plating for 3D smart sensor systems",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "F Santagata and G Fiorentino and M Nie and C Farriciello and RH Poelma and GQ Zhang and PM Sarro",
note = "Onder dezelfde titel als artikel van 11 blz. in 2013 verschenen in J. Micromech. Microeng; met verschillende auteurs.; IEEE Sensors 2012 : 11th IEEE Sensors Conference ; Conference date: 28-10-2012 Through 31-10-2012",
year = "2012",
language = "English",
publisher = "IEEE Society",
pages = "668--671",
editor = "{Fang et al}, W",
booktitle = "Proceedings 11th IEEE Sensors Conference",
}