Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation

LJ Ernst; KMB Jansen; MK Saraswat; C van t Hof; GQ Zhang; DG Yang; HJL Bressers

Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation

LJ Ernst, KMB Jansen, MK Saraswat, C van t Hof, GQ Zhang, DG Yang, HJL Bressers

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Abstract

In order to establish the possible influence of residual stress and strain fields after cure on the failure prediction of electronic packages, cure-dependent viscoelastic constitutive relations for the applied polymers are required. This paper gives an overview of progress in the field of viscoelastic modeling and characterization of applied polymers over the past few years. It also discusses limitations and needs for future development.

Original language	Undefined/Unknown
Title of host publication	Proceedings of 2006 7th International Conference on Electronics Packaging Technology
Editors	Sheng Liu
Place of Publication	Shanghai, China
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	123-129
Number of pages	7
ISBN (Print)	1-4244-0620-X
Publication status	Published - 2006
Event	2006 7th International Conference on Electronics Packaging Technology - Shanghai. China Duration: 26 Aug 2006 → 29 Aug 2006

Publication series

Name
Publisher	Institute of Electrical and Electronics Engineers, Inc.

Conference

Conference	2006 7th International Conference on Electronics Packaging Technology
Period	26/08/06 → 29/08/06

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Ernst, LJ., Jansen, KMB., Saraswat, MK., van t Hof, C., Zhang, GQ., Yang, DG., & Bressers, HJL. (2006). Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation. In Sheng Liu (Ed.), Proceedings of 2006 7th International Conference on Electronics Packaging Technology (pp. 123-129). Institute of Electrical and Electronics Engineers (IEEE).

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title = "Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation",

abstract = "In order to establish the possible influence of residual stress and strain fields after cure on the failure prediction of electronic packages, cure-dependent viscoelastic constitutive relations for the applied polymers are required. This paper gives an overview of progress in the field of viscoelastic modeling and characterization of applied polymers over the past few years. It also discusses limitations and needs for future development.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "LJ Ernst and KMB Jansen and MK Saraswat and {van t Hof}, C and GQ Zhang and DG Yang and HJL Bressers",

year = "2006",

language = "Undefined/Unknown",

isbn = "1-4244-0620-X",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

pages = "123--129",

editor = "{Sheng Liu}",

booktitle = "Proceedings of 2006 7th International Conference on Electronics Packaging Technology",

address = "United States",

note = "2006 7th International Conference on Electronics Packaging Technology ; Conference date: 26-08-2006 Through 29-08-2006",

}

Ernst, LJ, Jansen, KMB, Saraswat, MK, van t Hof, C, Zhang, GQ, Yang, DG & Bressers, HJL 2006, Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation. in Sheng Liu (ed.), Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Institute of Electrical and Electronics Engineers (IEEE), Shanghai, China, pp. 123-129, 2006 7th International Conference on Electronics Packaging Technology, 26/08/06.

Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation. / Ernst, LJ; Jansen, KMB; Saraswat, MK et al.
Proceedings of 2006 7th International Conference on Electronics Packaging Technology. ed. / Sheng Liu. Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), 2006. p. 123-129.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation

AU - Ernst, LJ

AU - Jansen, KMB

AU - Saraswat, MK

AU - van t Hof, C

AU - Zhang, GQ

AU - Yang, DG

AU - Bressers, HJL

PY - 2006

Y1 - 2006

N2 - In order to establish the possible influence of residual stress and strain fields after cure on the failure prediction of electronic packages, cure-dependent viscoelastic constitutive relations for the applied polymers are required. This paper gives an overview of progress in the field of viscoelastic modeling and characterization of applied polymers over the past few years. It also discusses limitations and needs for future development.

AB - In order to establish the possible influence of residual stress and strain fields after cure on the failure prediction of electronic packages, cure-dependent viscoelastic constitutive relations for the applied polymers are required. This paper gives an overview of progress in the field of viscoelastic modeling and characterization of applied polymers over the past few years. It also discusses limitations and needs for future development.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 1-4244-0620-X

SP - 123

EP - 129

BT - Proceedings of 2006 7th International Conference on Electronics Packaging Technology

A2 - Sheng Liu, null

PB - Institute of Electrical and Electronics Engineers (IEEE)

CY - Shanghai, China

T2 - 2006 7th International Conference on Electronics Packaging Technology

Y2 - 26 August 2006 through 29 August 2006

ER -

Ernst LJ, Jansen KMB, Saraswat MK, van t Hof C, Zhang GQ, Yang DG et al. Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation. In Sheng Liu, editor, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE). 2006. p. 123-129