In order to establish the possible influence of residual stress and strain fields after cure on the failure prediction of electronic packages, cure-dependent viscoelastic constitutive relations for the applied polymers are required. This paper gives an overview of progress in the field of viscoelastic modeling and characterization of applied polymers over the past few years. It also discusses limitations and needs for future development.
|Publisher||Institute of Electrical and Electronics Engineers, Inc.|
|Conference||2006 7th International Conference on Electronics Packaging Technology|
|Period||26/08/06 → 29/08/06|
- conference contrib. refereed
- Conf.proc. > 3 pag