@inproceedings{8b63f0f22694415fbf04d9b0f5b5efc2,
title = "Fully Cure-Dependent Modelling and Characterization of EMC's with Application to Package Warpage Simulation",
abstract = "Package warpage, interface delamination and thermal fatigue are the major reliability concerns for micro-electronic packages, caused by mismatch in thermal expansion together with residual stress originating from the curing process of the packaging polymers. To investigate the influence of the residual stress- and strain fields on the failure predictions and to optimise the product for reliability, cure-dependent viscoelastic constitutive relations for the applied polymers are required. The present paper gives an overview of recent progress in establishing such relations. A model moulding compound is used for cure dependent characterization and is subsequently used for QFN package moulding. The modelled and the experimentally obtained warpage have been compared.",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "LJ Ernst and KMB Jansen and MK Saraswat and GQ Zhang and D Yang and {van t Hof}, C and HJL Bressers",
year = "2006",
language = "Undefined/Unknown",
isbn = "1-4244-0260-3",
publisher = "IEEE Society",
pages = "23--27",
editor = "sn",
booktitle = "Proceedings 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces",
note = "2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces ; Conference date: 15-03-2006 Through 17-03-2006",
}