Fully cure-dependent polymer modeling and application to QFN-packages warpage

D Yang, LJ Ernst, KMB Jansen, C van t Hof, GQ Zhang, WD van Driel, HJL Bressers

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationEPTC 2004: 6th electronic packaging technology Conference
EditorsKC Toh, YC Mui, J How, JHL Pang
Place of PublicationS.l.
PublisherIEEE CPMT Society
Pages87-91
Number of pages5
ISBN (Print)0-7803-8822-4
Publication statusPublished - 2004
EventEPTC 2004: 6th electronic packaging technology Conference - S.l., Singapore, Singapore
Duration: 8 Dec 200410 Dec 2004

Publication series

Name
PublisherIEEE CPMT Society

Conference

ConferenceEPTC 2004: 6th electronic packaging technology Conference
CountrySingapore
CitySingapore
Period8/12/0410/12/04

Keywords

  • Conf.proc. > 3 pag

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