Fully cure-dependent polymer modeling and application to QFN-packages warpage

D Yang; LJ Ernst; KMB Jansen; C van t Hof; GQ Zhang; WD van Driel; HJL Bressers

Fully cure-dependent polymer modeling and application to QFN-packages warpage

D Yang, LJ Ernst, KMB Jansen, C van t Hof, GQ Zhang, WD van Driel, HJL Bressers

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

4 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	EPTC 2004: 6th electronic packaging technology Conference
Editors	KC Toh, YC Mui, J How, JHL Pang
Place of Publication	S.l.
Publisher	IEEE CPMT Society
Pages	87-91
Number of pages	5
ISBN (Print)	0-7803-8822-4
Publication status	Published - 2004
Event	EPTC 2004: 6th electronic packaging technology Conference - S.l., Singapore, Singapore Duration: 8 Dec 2004 → 10 Dec 2004

Publication series

Name
Publisher	IEEE CPMT Society

Conference

Conference	EPTC 2004: 6th electronic packaging technology Conference
Country/Territory	Singapore
City	Singapore
Period	8/12/04 → 10/12/04

Bibliographical note

IEEE Catalog No.: 04EX971C

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{633dc77221ed48d2ab36ace141dffb3e,

title = "Fully cure-dependent polymer modeling and application to QFN-packages warpage",

keywords = "Conf.proc. > 3 pag",

author = "D Yang and LJ Ernst and KMB Jansen and {van t Hof}, C and GQ Zhang and {van Driel}, WD and HJL Bressers",

note = "IEEE Catalog No.: 04EX971C; EPTC 2004: 6th electronic packaging technology Conference ; Conference date: 08-12-2004 Through 10-12-2004",

year = "2004",

language = "Undefined/Unknown",

isbn = "0-7803-8822-4",

publisher = "IEEE CPMT Society",

pages = "87--91",

editor = "KC Toh and YC Mui and J How and JHL Pang",

booktitle = "EPTC 2004: 6th electronic packaging technology Conference",

}

Yang, D, Ernst, LJ, Jansen, KMB, van t Hof, C, Zhang, GQ, van Driel, WD & Bressers, HJL 2004, Fully cure-dependent polymer modeling and application to QFN-packages warpage. in KC Toh, YC Mui, J How & JHL Pang (eds), EPTC 2004: 6th electronic packaging technology Conference. IEEE CPMT Society, S.l., pp. 87-91, EPTC 2004: 6th electronic packaging technology Conference, Singapore, Singapore, 8/12/04.

Fully cure-dependent polymer modeling and application to QFN-packages warpage. / Yang, D; Ernst, LJ; Jansen, KMB et al.
EPTC 2004: 6th electronic packaging technology Conference. ed. / KC Toh; YC Mui; J How; JHL Pang. S.l.: IEEE CPMT Society, 2004. p. 87-91.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Fully cure-dependent polymer modeling and application to QFN-packages warpage

AU - Yang, D

AU - Ernst, LJ

AU - Jansen, KMB

AU - van t Hof, C

AU - Zhang, GQ

AU - van Driel, WD

AU - Bressers, HJL

N1 - IEEE Catalog No.: 04EX971C

PY - 2004

Y1 - 2004

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-8822-4

SP - 87

EP - 91

BT - EPTC 2004: 6th electronic packaging technology Conference

A2 - Toh, KC

A2 - Mui, YC

A2 - How, J

A2 - Pang, JHL

PB - IEEE CPMT Society

CY - S.l.

T2 - EPTC 2004: 6th electronic packaging technology Conference

Y2 - 8 December 2004 through 10 December 2004

ER -