Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging

Jiajie Fan, Yichen Qian, Wei Chen, Jing Jiang, Zhuorui Tang, Xuejun Fan, Guoqi Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)
9 Downloads (Pure)

Abstract

A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the reliability of a FOPLP SiC MOSFET power module was investigated. To improve the thermal management and thermal cycling reliability of the designed SiC module, genetic algorithm (GA)–assisted optimization methods were proposed to optimize the RDL via size. First, the heat dissipation and the plastic work density of the SiC MOSFET module with various via diameters and depths were simulated using finite element simulations. Next, both the ant colony optimization-backpropagation neural network (ACOBPNN) with finite element simulation and the nondominated sorting genetic algorithm (NSGA-II) with theoretical model were developed to optimize the RDL via size. The results revealed that: (1) smaller via depth and size reduce the heat dissipation and thermal cycling reliability of the RDL via; (2) through both the ACO-BPNN and NSGA-II, the same optimal heat dissipation and plastic work density can be achieved in the designed module. (3) ACO-BPNN with assist of finite element simulation can provide a more effective optimization in complex packaging structure.
Original languageEnglish
Title of host publicationProceedings of the 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
EditorsL. O'Conner
Place of PublicationPiscataway
PublisherIEEE
Pages260-265
Number of pages6
ISBN (Electronic)978-1-6654-7943-1
ISBN (Print)978-1-6654-7944-8
DOIs
Publication statusPublished - 2022
Event2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) - San Diego, United States
Duration: 31 May 20223 Jun 2022
Conference number: 72nd

Conference

Conference2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Abbreviated titleECTC 2022
Country/TerritoryUnited States
CitySan Diego
Period31/05/223/06/22

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

  • SiC MOSFET
  • FOPLP
  • ACO-BPNN
  • NSGA-II
  • Reliability optimization

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