Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

P Liu, J Zhang, R Sokolovskij, HW van Zeijl, BAZ Mimoun, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)
Original languageEnglish
Title of host publicationProceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013)
EditorsGQ Zhang
Place of PublicationPiscataway
PublisherIEEE Society
Pages1-6
Number of pages6
ISBN (Print)978-1-4673-6138-5
DOIs
Publication statusPublished - 2013
EventEuroSimE 2013 - Wroclaw, Poland
Duration: 14 Apr 201317 Apr 2013

Publication series

Name
PublisherIEEE

Conference

ConferenceEuroSimE 2013
CountryPoland
CityWroclaw
Period14/04/1317/04/13

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