Geometry sensivity analyses of micro-structures of IC packages on metal lines shifting induced by plastic deformation

YT He; GQ Zhang; F Li; LJ Ernst; J Zhang

Geometry sensivity analyses of micro-structures of IC packages on metal lines shifting induced by plastic deformation

YT He, GQ Zhang, F Li, LJ Ernst, J Zhang

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications : Advances in engineering plasticity and its applications. Part I
Editors	WP Shen, JQ Xu
Place of Publication	Uetikon-Zuerich
Publisher	Trans Tech Publications
Pages	361-366
Number of pages	6
ISBN (Print)	0-87849-951-2
Publication status	Published - 2004
Event	AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications: Advances in engineering plasticity and its applications - Duration: 22 Sept 2004 → 26 Sept 2004

Publication series

Name
Publisher	Trans Tech Publications

Name	Key Engineering Materials
Volume	274-276
ISSN (Print)	1013-9826

Conference

Conference	AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications
Period	22/09/04 → 26/09/04

Keywords

Conf.proc. > 3 pag

Cite this

He, YT., Zhang, GQ., Li, F., Ernst, LJ., & Zhang, J. (2004). Geometry sensivity analyses of micro-structures of IC packages on metal lines shifting induced by plastic deformation. In WP. Shen, & JQ. Xu (Eds.), AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications : Advances in engineering plasticity and its applications. Part I (pp. 361-366). (Key Engineering Materials; Vol. 274-276). Trans Tech Publications.

He, YT ; Zhang, GQ ; Li, F et al. / Geometry sensivity analyses of micro-structures of IC packages on metal lines shifting induced by plastic deformation. AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications : Advances in engineering plasticity and its applications. Part I. editor / WP Shen ; JQ Xu. Uetikon-Zuerich : Trans Tech Publications, 2004. pp. 361-366 (Key Engineering Materials).

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title = "Geometry sensivity analyses of micro-structures of IC packages on metal lines shifting induced by plastic deformation",

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author = "YT He and GQ Zhang and F Li and LJ Ernst and J Zhang",

year = "2004",

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isbn = "0-87849-951-2",

publisher = "Trans Tech Publications",

pages = "361--366",

editor = "WP Shen and JQ Xu",

booktitle = "AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications : Advances in engineering plasticity and its applications. Part I",

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note = "AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications ; Conference date: 22-09-2004 Through 26-09-2004",

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He, YT, Zhang, GQ, Li, F, Ernst, LJ & Zhang, J 2004, Geometry sensivity analyses of micro-structures of IC packages on metal lines shifting induced by plastic deformation. in WP Shen & JQ Xu (eds), AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications : Advances in engineering plasticity and its applications. Part I. Key Engineering Materials, vol. 274-276, Trans Tech Publications, Uetikon-Zuerich, pp. 361-366, AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications, 22/09/04.

Geometry sensivity analyses of micro-structures of IC packages on metal lines shifting induced by plastic deformation. / He, YT; Zhang, GQ; Li, F et al.
AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications : Advances in engineering plasticity and its applications. Part I. ed. / WP Shen; JQ Xu. Uetikon-Zuerich: Trans Tech Publications, 2004. p. 361-366 (Key Engineering Materials; Vol. 274-276).

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Geometry sensivity analyses of micro-structures of IC packages on metal lines shifting induced by plastic deformation

AU - He, YT

AU - Zhang, GQ

AU - Li, F

AU - Ernst, LJ

AU - Zhang, J

PY - 2004

Y1 - 2004

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-87849-951-2

SP - 361

EP - 366

BT - AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications : Advances in engineering plasticity and its applications. Part I

A2 - Shen, WP

A2 - Xu, JQ

PB - Trans Tech Publications

CY - Uetikon-Zuerich

T2 - AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications

Y2 - 22 September 2004 through 26 September 2004

ER -

He YT, Zhang GQ, Li F, Ernst LJ, Zhang J. Geometry sensivity analyses of micro-structures of IC packages on metal lines shifting induced by plastic deformation. In Shen WP, Xu JQ, editors, AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications : Advances in engineering plasticity and its applications. Part I. Uetikon-Zuerich: Trans Tech Publications. 2004. p. 361-366. (Key Engineering Materials).