Geometry sensivity analyses of micro-structures of IC packages on metal lines shifting induced by plastic deformation

YT He, GQ Zhang, F Li, LJ Ernst, J Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationAEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications : Advances in engineering plasticity and its applications. Part I
EditorsWP Shen, JQ Xu
Place of PublicationUetikon-Zuerich
PublisherTrans Tech Publications
Pages361-366
Number of pages6
ISBN (Print)0-87849-951-2
Publication statusPublished - 2004
EventAEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications: Advances in engineering plasticity and its applications -
Duration: 22 Sep 200426 Sep 2004

Publication series

Name
PublisherTrans Tech Publications
NameKey Engineering Materials
Volume274-276
ISSN (Print)1013-9826

Conference

ConferenceAEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications
Period22/09/0426/09/04

Keywords

  • Conf.proc. > 3 pag

Cite this

He, YT., Zhang, GQ., Li, F., Ernst, LJ., & Zhang, J. (2004). Geometry sensivity analyses of micro-structures of IC packages on metal lines shifting induced by plastic deformation. In WP. Shen, & JQ. Xu (Eds.), AEPA 2004: 7th Asia-Pacific symposium on engineering plasticity and its applications : Advances in engineering plasticity and its applications. Part I (pp. 361-366). (Key Engineering Materials; Vol. 274-276). Trans Tech Publications.