Gluing as an alternative to solder flexible batteries for its use in system-in-a-package: preliminary results

NB Palacios Aguilera, JR Mollinger, J Bastemeijer, J Zhou, PJ French, A Bossche

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

1 Citation (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings of 11th Electronics packaging technology conference
Editors s.n.
Place of PublicationLos Alamitos, USA
PublisherIEEE Society
Pages550-555
Number of pages6
ISBN (Print)978-1-4244-5100-5
Publication statusPublished - 2009
Event11th Electronics packaging technology conference (EPTC2009), Singapore - Los Alamitos, USA
Duration: 9 Dec 200911 Dec 2009

Publication series

Name
PublisherIEEE

Conference

Conference11th Electronics packaging technology conference (EPTC2009), Singapore
Period9/12/0911/12/09

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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