INIS
power
100%
heat
100%
applications
100%
diamonds
100%
devices
42%
increasing
28%
surfaces
28%
substrates
28%
power input
28%
thermal properties
28%
performance
28%
solutions
28%
thermal gradients
14%
hot spots
14%
distribution
14%
demand
14%
reduction
14%
efficiency
14%
junctions
14%
simulation
14%
thickness
14%
processing
14%
films
14%
temperature distribution
14%
semiconductor materials
14%
reliability
14%
monitoring
14%
comparative evaluations
14%
thermal cycling
14%
thermal degradation
14%
integrated circuits
14%
packaging
14%
Engineering
Application
100%
Power Electronics
100%
Diamond
100%
Integration
100%
Active Device
33%
Device Surface
33%
Substrates
33%
Thickness
16%
Thermal Degradation
16%
Power Input
16%
Integrated Circuit
16%
Thermal Gradient
16%
Efficiency
16%
Junction Temperature
16%
High Temperature
16%
Input Power
16%
Electronics
16%
Research
16%
Processing
16%
Performance
16%
Temperature Distribution
16%
Reliability
16%
Electronic Module
16%
Hot Spot
16%
Cycles
16%
Increasing Demand
16%
Device Performance
16%
Reduction
16%
Led Package
16%
Semiconductor
16%
Earth and Planetary Sciences
Utilization
100%
Diamond
100%
Heat
100%
Thermodynamic Property
28%
Increasing
28%
Input
28%
Substrate
28%
High Temperature
14%
Experience
14%
Integrated Circuit
14%
Standard
14%
Electronic Module
14%
Reliability
14%
Semiconductors
14%
Cycle
14%
Temperature Distribution
14%
Efficiency
14%
Diamond Films
14%
Package
14%
Thermal Degradation
14%
Research
14%
Packaging
14%
Material Science
Diamond
100%
Temperature
60%
Devices
60%
Surface
40%
Thermal Property
40%
Materials
20%
Semiconductor Material
20%
Thermal Degradation
20%
Thermal Cycling
20%
Electronic Circuit
20%
Diamond Films
20%
Keyphrases
Diamond Heat Spreader
100%
Thermal Solution
50%
Thermal Hotspot
25%
Circuit Module
25%
Heterogeneous Approach
25%
Electronic Substrates
25%
Chemical Engineering
Diamond
100%
Thermodynamic Property
33%
Temperature
33%
Thermal Gradient
16%
Temperature Distribution
16%
Thermal Cycling
16%